Loading...

TMS320C6474FCUN2

Texas Instruments

TMS320C6474FCUN2 by Texas Instruments

TMS320C6474FCUN2 by Texas Instruments is a DSP with 32-bit external data bus, 14-bit address bus, and 64 DMA channels. It is used in digital signal processing applications requiring fixed-point format and low power mode for efficient performance. The package style is grid array with fine pitch terminals, suitable for surface mount assembly.

Median Price

$272.116

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 284 parts In-Stock

1+ parts

$202.421

100+ parts

$183.226

1k+ parts

$174.501

10k+ parts

-

284

$202.421

$183.226

$174.501

-

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$341.810

100+ parts

$275.640

1k+ parts

-

10k+ parts

-

1

$341.810

$275.640

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,588 parts In-Stock

1+ parts

$192.300

100+ parts

-

1k+ parts

-

10k+ parts

-

2,588

$192.300

-

-

-

Vyrian

USA . 4,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,980

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 13 parts In-Stock

1+ parts

$17.955

100+ parts

-

1k+ parts

-

10k+ parts

-

13

$17.955

-

-

-

Parana Technologies

USA . 1,997 parts In-Stock

1+ parts

$46.636

100+ parts

$4,330.860

1k+ parts

$41.972

10k+ parts

-

1,997

$46.636

$4,330.860

$41.972

-

DigiPath Technology Company

USA . 761 parts In-Stock

1+ parts

$51.352

100+ parts

-

1k+ parts

-

10k+ parts

-

761

$51.352

-

-

-

ChromeModa Solutions

Germany . 4,458 parts In-Stock

1+ parts

$52.400

100+ parts

$42.968

1k+ parts

-

10k+ parts

-

4,458

$52.400

$42.968

-

-

IDEA Electronic Components Group

UK . 128 parts In-Stock

1+ parts

$52.400

100+ parts

$49.780

1k+ parts

$47.160

10k+ parts

-

128

$52.400

$49.780

$47.160

-

Corphita

USA . 309 parts In-Stock

1+ parts

$182.179

100+ parts

-

1k+ parts

-

10k+ parts

-

309

$182.179

-

-

-

Microchip USA

USA . 1,059 parts In-Stock

1+ parts

$366.452

100+ parts

-

1k+ parts

-

10k+ parts

-

1,059

$366.452

-

-

-

Overview

Experience unparalleled performance with the TMS320C6474FCUN2 by Texas Instruments, a leading manufacturer in the digital signal processor category. This state-of-the-art DSP offers integrated cache, advanced peripheral IC type, and multiple internal bus architecture for optimal functionality. Whether you're working on audio processing, telecommunications, or industrial control applications, this product delivers exceptional value with its low power mode, high-speed data processing capabilities, and reliable performance. Upgrade your projects today with the TMS320C6474FCUN2 and unlock endless possibilities in digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package provides good protection for the DSP, making it durable and resistant to external elements.

Integrated Cache: YES

Integrated cache helps in reducing processing time and improving performance of the DSP.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving design.

External Data Bus Width: 32

A wider external data bus width allows for faster data transfer and processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high performance, making it an efficient choice for the DSP.

No. of DMA Channels: 64

Having 64 DMA channels means the DSP can handle a high volume of data transfers efficiently.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6474FCUN2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

0.9-1.2V CORE NOMINAL VALUE AVAILABLE

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B561

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

561

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

ROM Programmability:

MROM

Maximum Seated Height:

3.3 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6474FCUN2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20