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TMS320C6472EZTZ7

Texas Instruments

TMS320C6472EZTZ7 by Texas Instruments

TMS320C6472EZTZ7 by Texas Instruments is a 32-bit DSP with 737 terminals, operating at max frequency of 700MHz. Ideal for digital signal processing applications, it features 8192 RAM words and supports boundary scan testing. With low power mode and multiple internal bus architecture, this CMOS technology-based processor offers fixed-point format for efficient data processing.

Median Price

$333.100

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$275.850

100+ parts

$259.300

1k+ parts

$242.750

10k+ parts

-

1

$275.850

$259.300

$242.750

-

DigiKey

USA . 1 parts In-Stock

1+ parts

$333.100

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$333.100

-

-

-

Verical

USA . 1 parts In-Stock

1+ parts

$400.363

100+ parts

$376.337

1k+ parts

$340.313

10k+ parts

-

1

$400.363

$376.337

$340.313

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,147 parts In-Stock

1+ parts

$304.276

100+ parts

-

1k+ parts

-

10k+ parts

-

2,147

$304.276

-

-

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Vyrian

USA . 6,416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,416

-

-

-

-

Sensible Micro Corp

USA . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,585 parts In-Stock

1+ parts

$44.512

100+ parts

-

1k+ parts

-

10k+ parts

-

2,585

$44.512

-

-

-

Parana Technologies

USA . 1,786 parts In-Stock

1+ parts

$60.849

100+ parts

$5,650.780

1k+ parts

$54.764

10k+ parts

-

1,786

$60.849

$5,650.780

$54.764

-

DigiPath Technology Company

USA . 1,000 parts In-Stock

1+ parts

$67.003

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$67.003

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-

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ChromeModa Solutions

Germany . 1,916 parts In-Stock

1+ parts

$68.370

100+ parts

$56.063

1k+ parts

-

10k+ parts

-

1,916

$68.370

$56.063

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-

IDEA Electronic Components Group

UK . 390 parts In-Stock

1+ parts

$68.370

100+ parts

$64.952

1k+ parts

$61.533

10k+ parts

-

390

$68.370

$64.952

$61.533

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Corphita

USA . 1,180 parts In-Stock

1+ parts

$288.261

100+ parts

-

1k+ parts

-

10k+ parts

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1,180

$288.261

-

-

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Microchip USA

USA . 128 parts In-Stock

1+ parts

$313.610

100+ parts

$305.250

1k+ parts

$301.060

10k+ parts

$296.880

128

$313.610

$305.250

$301.060

$296.880

Component Stockers USA

USA . 1 parts In-Stock

1+ parts

$330.630

100+ parts

-

1k+ parts

-

10k+ parts

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1

$330.630

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Overview

Unlock unparalleled performance and efficiency with the Texas Instruments TMS320C6472EZTZ7 Digital Signal Processor. Trusted by industry leaders worldwide, Texas Instruments delivers cutting-edge technology that pushes the boundaries of what's possible. Perfect for a wide range of applications, this DSP offers unmatched value, benefits, and advantages to customers seeking top-tier quality and reliability. Experience the power of innovation with the TMS320C6472EZTZ7 and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the product more energy-efficient.

Address Bus Width: 14

With a wider address bus width, the product can handle larger memory addresses and data transfers, increasing its processing capability.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, optimizing the layout and design of the final product.

Bit Size: 32

With a 32-bit architecture, the product can perform complex calculations and process large amounts of data at high speeds, making it suitable for demanding applications.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supply voltages allows for flexibility in different operating conditions and power requirements, making the product versatile.

No. of Terminals: 737

Having a large number of terminals provides ample connectivity options for external devices and peripherals, enhancing the product's compatibility and functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers high pin density and better thermal performance, improving the overall reliability and performance of the product.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures stable operation even under low power conditions, enhancing the product's reliability in various environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to function in harsh environmental conditions without compromising performance, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can operate effectively even in cold environments, increasing its versatility and usability.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the product.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the PCB layout and assembly process, optimizing space and improving the overall design of the product.

Maximum Seated Height: 3.242 mm

The low maximum seated height allows for a compact and slim profile of the product, making it suitable for space-constrained applications.

RAM Words: 8192

With a large RAM capacity, the product can store and process a significant amount of data efficiently, enhancing its performance in data-intensive tasks.

Width: 24 mm

The compact width of the product enables easy integration into various systems and devices, increasing its versatility and compatibility.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the product during production, ensuring high reliability and quality control.

External Data Bus Width: 32

With a wide external data bus width, the product can transfer data quickly and efficiently between external devices, improving overall performance and throughput.

Maximum Clock Frequency: 700 MHz

The high maximum clock frequency enables the product to process instructions at a rapid pace, making it suitable for real-time applications and high-speed computing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps in preventing overheating and damage during soldering processes, ensuring the reliability and longevity of the product.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance allows for robust solder joints and reliability in the manufacturing process, ensuring consistent performance and quality.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enhances the product's processing capabilities and efficiency, enabling it to handle complex tasks with optimized performance.

Length: 24 mm

The compact length of the product enables space-saving designs and easy integration into various systems, enhancing its versatility and usability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types allows the product to interface with a wide range of external devices and sensors, expanding its functionality and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in different operating conditions.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections, ensuring stable performance and durability of the product even in demanding environments.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent and reliable operation of the product, enhancing its performance and longevity.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density packaging and efficient use of PCB space, optimizing the design and layout of the final product.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances computational efficiency, making the product suitable for real-time signal processing and mathematical tasks.

Moisture Sensitivity Level (MSL): 4

The MSL rating of 4 indicates that the product has moderate moisture sensitivity, requiring standard handling and storage practices to prevent damage during assembly and operation.

Low Power Mode: YES

The low power mode feature allows the product to operate in a power-efficient state when not performing intensive tasks, extending battery life and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6472EZTZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3 V I/O SUPPLY

Address Bus Width:

14

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

700 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B737

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

737

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA737,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6472EZTZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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