Loading...

TMS320C6472ECTZ7

Texas Instruments

TMS320C6472ECTZ7 by Texas Instruments

TMS320C6472ECTZ7 by Texas Instruments is a 32-bit DSP with integrated cache and 737 terminals. It operates at a max clock frequency of 50 MHz, suitable for digital signal processing applications requiring high-speed performance in a compact square package. With features like boundary scan and low power mode, it offers efficient processing capabilities for various electronic devices.

Median Price

$214.282

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,683 parts In-Stock

1+ parts

$214.282

100+ parts

$193.962

1k+ parts

$184.726

10k+ parts

-

1,683

$214.282

$193.962

$184.726

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,823 parts In-Stock

1+ parts

$203.568

100+ parts

-

1k+ parts

-

10k+ parts

-

3,823

$203.568

-

-

-

Vyrian

USA . 3,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,435

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$10.320

100+ parts

-

1k+ parts

-

10k+ parts

-

766

$10.320

-

-

-

Parana Technologies

USA . 1,604 parts In-Stock

1+ parts

$64.504

100+ parts

-

1k+ parts

-

10k+ parts

-

1,604

$64.504

-

-

-

DigiPath Technology Company

USA . 819 parts In-Stock

1+ parts

$71.026

100+ parts

$65.344

1k+ parts

-

10k+ parts

-

819

$71.026

$65.344

-

-

IDEA Electronic Components Group

UK . 2,140 parts In-Stock

1+ parts

$72.476

100+ parts

$68.852

1k+ parts

$65.228

10k+ parts

-

2,140

$72.476

$68.852

$65.228

-

ChromeModa Solutions

Germany . 1,294 parts In-Stock

1+ parts

$72.476

100+ parts

$59.430

1k+ parts

-

10k+ parts

-

1,294

$72.476

$59.430

-

-

Corohmni

South Africa . 2,602 parts In-Stock

1+ parts

$85.454

100+ parts

-

1k+ parts

-

10k+ parts

-

2,602

$85.454

-

-

-

Ampacity Inc.

Singapore . 1,579 parts In-Stock

1+ parts

$182.140

100+ parts

-

1k+ parts

-

10k+ parts

-

1,579

$182.140

-

-

-

Corphita

USA . 2,712 parts In-Stock

1+ parts

$192.854

100+ parts

-

1k+ parts

-

10k+ parts

-

2,712

$192.854

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Component Stockers USA

USA . 22 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22

-

-

-

-

Overview

Experience top-notch signal processing performance with the TMS320C6472ECTZ7 by Texas Instruments, a leading manufacturer in the industry. This powerful digital signal processor is perfect for a wide range of applications, offering integrated cache, low power mode, and multiple DMA channels for optimal efficiency. With a reliable package body material and advanced technology, this DSP provides exceptional value and benefits to customers seeking high-quality solutions for their projects. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the package, making the product suitable for various environmental conditions.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the DSP, making it a good choice for tasks requiring quick data access.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V ensures power efficiency, making this DSP a suitable choice for applications where power consumption is a concern.

On Chip Data RAM Width: 8

With an on-chip data RAM width of 8, this DSP can handle larger amounts of data efficiently, making it a good choice for data-intensive applications.

Address Bus Width: 14

The address bus width of 14 allows for efficient data transfer and addressing capabilities, making this DSP suitable for complex computational tasks.

Package Shape: SQUARE

The square package shape provides a compact design, saving space and making this DSP a good choice for applications where size constraints are a concern.

Bit Size: 32

With a bit size of 32, this DSP can handle complex calculations and data processing efficiently, making it suitable for tasks requiring high computational power.

Power Supplies (V): 1.1,1.8,3.3

The multiple power supply options provide flexibility in powering the DSP, allowing it to be used in various applications with different voltage requirements.

No. of Terminals: 737

The large number of terminals allows for multiple connections, enabling the DSP to interface with various external components, making it suitable for versatile applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style ensures easy installation and secure connections, making this DSP a good choice for applications requiring reliable connections.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage of 0.95 V ensures low power consumption, making this DSP suitable for battery-operated devices or applications where power efficiency is critical.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this DSP can function effectively in high-temperature environments, making it a good choice for industrial applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C allows this DSP to operate in cold environments, making it suitable for applications in varying temperature conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper provides durability and reliability in connections, ensuring the longevity of the DSP in demanding operating conditions.

Terminal Position: BOTTOM

The bottom terminal position allows for easy PCB mounting and secure connections, making this DSP a suitable choice for applications requiring stable connections.

Maximum Seated Height: 3.242 mm

The maximum seated height of 3.242 mm ensures a compact form factor, making this DSP suitable for applications with space constraints.

RAM Words: 8192

With a large RAM word size of 8192, this DSP can store and process a significant amount of data, making it suitable for memory-intensive applications.

Width: 24 mm

The compact width of 24 mm allows for easy integration into various electronic devices, making this DSP a good choice for applications requiring a small form factor.

Boundary Scan: YES

Having boundary scan capability allows for easy testing and debugging of the DSP, making it a good choice for applications requiring efficient maintenance and troubleshooting.

External Data Bus Width: 32

With an external data bus width of 32, this DSP can transfer data quickly and efficiently, making it suitable for applications requiring high-speed data processing.

Maximum Clock Frequency: 50 MHz

The maximum clock frequency of 50 MHz allows for fast data processing and execution, making this DSP suitable for applications requiring real-time signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this DSP can withstand reflow soldering processes, ensuring reliable connections in manufacturing.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C indicates the durability of the DSP during soldering processes, making it suitable for manufacturing environments.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architecture allows for efficient data transfer and processing, making this DSP a good choice for tasks requiring complex data operations.

Length: 24 mm

The compact length of 24 mm allows for easy integration into various electronic devices, making this DSP a good choice for applications with limited space.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional capabilities, this DSP can handle a variety of tasks efficiently, making it suitable for versatile applications.

No. of Timers: 14

Having 14 timers allows for precise timing control in applications, making this DSP a good choice for tasks that require multiple timing functions.

Technology: CMOS

The CMOS technology used in this DSP ensures low power consumption and high performance, making it a good choice for battery-operated devices or energy-efficient applications.

Terminal Form: BALL

The ball terminal form provides secure connections and easy soldering, making this DSP a good choice for applications requiring stable and reliable connections.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V indicates efficient power consumption, making this DSP suitable for applications where energy efficiency is important.

No. of DMA Channels: 64

Having 64 DMA channels allows for efficient data transfer and processing, making this DSP suitable for applications requiring high-speed data operations.

ROM Programmability: MROM

The MROM programmability of the ROM allows for secure and reliable program storage, making this DSP a good choice for applications requiring permanent program storage.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch provides secure connections and easy mounting on PCBs, making this DSP suitable for applications requiring precise and stable connections.

Format: FIXED POINT

The fixed-point format allows for efficient data processing and calculation accuracy, making this DSP a good choice for applications requiring precise numerical operations.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates the durability of the DSP in humid conditions, making it suitable for applications in environments with varying moisture levels.

Low Power Mode: YES

The low power mode feature allows for reduced power consumption when not in use, making this DSP suitable for battery-operated devices or applications where energy efficiency is crucial.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8, this DSP can store and execute program instructions efficiently, making it a good choice for applications requiring fast program execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6472ECTZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

14

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B737

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

737

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA737,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6472ECTZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20