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TMS320C6455BGTZ2

Texas Instruments

TMS320C6455BGTZ2 by Texas Instruments

TMS320C6455BGTZ2 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 66.6 MHz. Ideal for digital signal processing applications requiring high-speed performance in a compact package.

Median Price

$233.880

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 34 parts In-Stock

1+ parts

$233.880

100+ parts

$229.220

1k+ parts

$224.540

10k+ parts

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34

$233.880

$229.220

$224.540

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Distributors (In-Stock)

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Vyrian

USA . 3,011 parts In-Stock

1+ parts

-

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3,011

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Digiode

USA . 2,019 parts In-Stock

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2,019

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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5

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ComSIT USA

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 528 parts In-Stock

1+ parts

$13.015

100+ parts

-

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528

$13.015

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One Stop Electronics

USA . 1,390 parts In-Stock

1+ parts

$21.000

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1,390

$21.000

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Parana Technologies

USA . 2,370 parts In-Stock

1+ parts

$41.859

100+ parts

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2,370

$41.859

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DigiPath Technology Company

USA . 1,547 parts In-Stock

1+ parts

$46.092

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1,547

$46.092

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ChromeModa Solutions

Germany . 6,864 parts In-Stock

1+ parts

$47.033

100+ parts

$38.567

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6,864

$47.033

$38.567

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IDEA Electronic Components Group

UK . 187 parts In-Stock

1+ parts

$47.033

100+ parts

$44.681

1k+ parts

$42.330

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187

$47.033

$44.681

$42.330

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$47.041

100+ parts

$42.807

1k+ parts

$38.574

10k+ parts

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2,500

$47.041

$42.807

$38.574

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Corohmni

South Africa . 5,005 parts In-Stock

1+ parts

$86.405

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5,005

$86.405

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Component Stockers USA

USA . 343 parts In-Stock

1+ parts

$99.990

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343

$99.990

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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A-Z Elektronik GmbH

Germany . 2,231 parts In-Stock

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Corphita

USA . 1,740 parts In-Stock

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1,740

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Overview

Unlock the power of cutting-edge technology with the TMS320C6455BGTZ2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors that are revolutionizing the way we interact with technology. Ideal for a wide range of applications, this DSP offers unparalleled performance and efficiency. Experience seamless operation and enhanced functionality with the TMS320C6455BGTZ2, providing customers with incredible value and reliability. Elevate your projects to new heights with this innovative product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the DSP, making it suitable for various environments.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the DSP, enhancing overall performance.

Maximum Supply Voltage: 1.2875 V

The high maximum supply voltage allows for flexibility in power management and compatibility with different voltage sources.

Address Bus Width: 20

With a wider address bus width, the DSP can access a larger memory space, enabling it to handle more complex algorithms and data.

Package Shape: SQUARE

The square package shape offers efficient use of space and allows for easier integration into circuit designs.

Bit Size: 32

A 32-bit processing capability allows for handling of large data sets and complex calculations, making the DSP suitable for demanding applications.

Power Supplies (V): 1.2

The stable power supply at 1.2V ensures reliable and consistent operation of the DSP without risking overheating or power fluctuations.

No. of Terminals: 697

Having a high number of terminals provides ample connectivity options and flexibility in circuit connections for the DSP.

Minimum Supply Voltage: 1.2125 V

The low minimum supply voltage helps in optimizing power consumption and efficiency, reducing overall energy usage.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range allows the DSP to function reliably even in high-temperature environments or under heavy workload.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being categorized as a digital signal processor with additional features makes this product versatile and suitable for a wide range of applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6455BGTZ2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e0

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

697

No. of Timers:

4

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.2875 V

Minimum Supply Voltage:

1.2125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6455BGTZ2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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