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TMS320C6421ZWTQ6

Texas Instruments

TMS320C6421ZWTQ6 by Texas Instruments

TMS320C6421ZWTQ6 by Texas Instruments is a 32-bit DSP with 600 MHz clock frequency, 12288 RAM words, and 22-bit address bus width. Ideal for industrial applications requiring high-speed signal processing in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,257 parts In-Stock

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Digiode

USA . 3,886 parts In-Stock

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AZTECH Wire

Italy . 383 parts In-Stock

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$10.265

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One Stop Electronics

USA . 1,203 parts In-Stock

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$23.000

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Corohmni

South Africa . 744 parts In-Stock

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Parana Technologies

USA . 1,149 parts In-Stock

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$59.861

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DigiPath Technology Company

USA . 303 parts In-Stock

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$65.915

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$60.642

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303

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ChromeModa Solutions

Germany . 3,174 parts In-Stock

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$67.260

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$55.153

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IDEA Electronic Components Group

UK . 2,269 parts In-Stock

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$67.260

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$63.897

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$60.534

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Corphita

USA . 483 parts In-Stock

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Microchip USA

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Overview

Discover the cutting-edge TMS320C6421ZWTQ6 by Texas Instruments, a top-tier Digital Signal Processor that promises unparalleled performance and reliability. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers a product that exceeds expectations. Ideal for a wide range of applications, this DSP offers customers exceptional value with its high-speed processing capabilities and efficient power consumption. Elevate your projects to new heights with the TMS320C6421ZWTQ6 and experience the advantages of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, ensuring a longer lifespan.

Surface Mount: YES

This feature allows for easy installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 22

A wider address bus allows for efficient handling of memory addresses, improving overall performance.

Bit Size: 32

A 32-bit architecture enables the DSP to process larger chunks of data at a time, enhancing speed and efficiency.

Power Supplies (V): 1.2,1.8,3.3

Multiple power supply options allow for flexibility in different applications and voltage requirements.

No. of Terminals: 361

Having a high number of terminals enables connectivity to various external components, enhancing functionality.

Internal Bus Architecture: MULTIPLE

Multiple internal buses facilitate efficient data transfer within the DSP, optimizing performance.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this DSP can operate reliably in harsh environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of various peripheral ICs expands the functionality and versatility of this DSP.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that this DSP is suitable for use in conditions with moderate humidity.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6421ZWTQ6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

600 MHz

External Data Bus Width:

8

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

12288

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6421ZWTQ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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