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TMS320C6421ZDU4

Texas Instruments

TMS320C6421ZDU4 by Texas Instruments

TMS320C6421ZDU4 by Texas Instruments is a 32-bit DSP with 400 MHz clock frequency, 12288 RAM words, and 22-bit address bus width. Ideal for digital signal processing applications requiring high-speed data processing and multiple timers in commercial-grade environments.

Median Price

$16.578

Lifecycle Status

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6

In-Stock Inventory

1k+

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Texas Instruments

USA . 520 parts In-Stock

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$16.578

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$14.481

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$9.987

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520

$16.578

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$9.987

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Distributors (In-Stock)

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Bristol Electronics

USA . 114 parts In-Stock

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$14.093

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$13.008

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Digiode

USA . 2,417 parts In-Stock

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$15.749

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Vyrian

USA . 8,581 parts In-Stock

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Dan-Mar Components

USA . 114 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 27 parts In-Stock

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Corphita

USA . 714 parts In-Stock

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$14.920

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AZTECH Wire

Italy . 178 parts In-Stock

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$16.350

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Parana Technologies

USA . 740 parts In-Stock

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$30.578

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$69.178

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$69.178

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DigiPath Technology Company

USA . 58 parts In-Stock

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$33.670

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$30.976

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ChromeModa Solutions

Germany . 1,584 parts In-Stock

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$34.357

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$28.173

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IDEA Electronic Components Group

UK . 76 parts In-Stock

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$34.357

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$32.639

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$30.921

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76

$34.357

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Corohmni

South Africa . 515 parts In-Stock

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GreenTree Electronics

Israel . 96 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the TMS320C6421ZDU4 by Texas Instruments. As a leader in the industry, Texas Instruments has crafted this top-of-the-line Digital Signal Processor to deliver unparalleled performance and reliability. With integrated cache and multiple power supplies, this DSP is versatile and efficient, making it ideal for a wide range of applications. Whether you're in need of high-speed data processing or advanced signal control, the TMS320C6421ZDU4 provides the value, benefits, and advantages that customers demand. Elevate your projects to new heights with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Integrated Cache: YES

The integrated cache improves processing speed and efficiency by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage ensures safe operation and protects the product from potential damage due to voltage spikes.

On Chip Data RAM Width: 8

With a wide data RAM width of 8, the product can handle large amounts of data efficiently, enhancing overall performance.

Address Bus Width: 22

A wide address bus width of 22 enables the processor to access and process a large memory space, improving computing capabilities.

Package Shape: SQUARE

The square package shape offers a compact design, saving space and making it suitable for applications with limited real estate.

Bit Size: 32

The 32-bit architecture allows for faster data processing and improved performance compared to lower bit sizes.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supply voltages provides flexibility for different system requirements and power efficiency.

No. of Terminals: 376

The high number of terminals allows for connectivity with various components, increasing the product's versatility and compatibility.

Package Style (Meter): GRID ARRAY

The grid array package style offers secure connections and efficient heat dissipation, ensuring reliable performance under high processing loads.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage ensures stable operation at lower power levels, enhancing energy efficiency and reducing heat generation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the product to function in a wide range of environments without overheating or performance degradation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in cold environments, making the product suitable for various applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides corrosion resistance, ensuring long-term reliability and stable electrical connections.

Terminal Position: BOTTOM

The bottom terminal position enhances thermal management and facilitates easy integration into different systems.

Maximum Seated Height: 2.48 mm

The low maximum seated height allows for compact system designs and improves airflow for better cooling.

RAM Words: 12288

The high number of RAM words enables the processor to store and manipulate large amounts of data in real-time, supporting complex operations.

Width: 23 mm

The moderate width provides a balance between compactness and connectivity options, making the product suitable for various form factors.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging, reducing development time and ensuring product quality.

External Data Bus Width: 8

The external data bus width of 8 allows for fast data transfer between the processor and external components, improving system performance.

Maximum Clock Frequency: 400 MHz

The high maximum clock frequency enables fast data processing and quick response times, making the product suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature allows for efficient soldering during manufacturing, ensuring reliable connections and product quality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand manufacturing processes without damage, enhancing reliability.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enables parallel processing and efficient data transfer within the processor, improving overall performance.

Length: 23 mm

The moderate length provides a good balance between compactness and connectivity options, making the product suitable for diverse applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade allows for operation in standard temperature ranges, making the product suitable for general-purpose applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances the product's compatibility with different components and expands its functionality.

No. of Timers: 5

The five timers provide versatile timing options for scheduling tasks and managing processes efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Terminal Form: BALL

The ball terminal form enables secure connections and efficient heat dissipation, ensuring reliable performance under high processing loads.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures stable operation and efficient power consumption, optimizing overall performance.

No. of DMA Channels: 72

The high number of DMA channels allows for efficient data transfer and management, improving system performance and responsiveness.

ROM Programmability: MROM

MROM programmability offers secure and reliable data storage for critical firmware and software, ensuring data integrity and system stability.

Terminal Pitch: 1 mm

The 1mm terminal pitch provides a balance between connectivity options and space efficiency, making the product versatile for various designs.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations and improves computational efficiency, making the product suitable for signal processing applications.

Moisture Sensitivity Level (MSL): 3

The MSL level 3 indicates the product can withstand moderate levels of moisture exposure, ensuring reliability in typical operating environments.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 enables the processor to store and execute program instructions efficiently, supporting fast operation and quick response times.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6421ZDU4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY AT 350MHZ

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

400 MHz

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

376

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

12288

ROM Programmability:

MROM

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6421ZDU4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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