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TMS320C6416TBGLZA6

Texas Instruments

TMS320C6416TBGLZA6 by Texas Instruments

TMS320C6416TBGLZA6 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.18 MHz. Ideal for industrial applications requiring high-speed signal processing in digital communication systems.

Median Price

$134.380

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13 parts In-Stock

1+ parts

$134.380

100+ parts

$131.700

1k+ parts

$129.010

10k+ parts

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13

$134.380

$131.700

$129.010

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,228 parts In-Stock

1+ parts

-

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7,228

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Digiode

USA . 3,486 parts In-Stock

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3,486

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Distributors (Availability)

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One Stop Electronics

USA . 1,472 parts In-Stock

1+ parts

$9.000

100+ parts

-

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1,472

$9.000

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AZTECH Wire

Italy . 654 parts In-Stock

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$10.233

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654

$10.233

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Corohmni

South Africa . 740 parts In-Stock

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$28.587

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740

$28.587

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Parana Technologies

USA . 1,268 parts In-Stock

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$52.571

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1,268

$52.571

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DigiPath Technology Company

USA . 1,950 parts In-Stock

1+ parts

$57.888

100+ parts

$53.257

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-

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1,950

$57.888

$53.257

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ChromeModa Solutions

Germany . 5,229 parts In-Stock

1+ parts

$59.069

100+ parts

$48.437

1k+ parts

-

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5,229

$59.069

$48.437

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IDEA Electronic Components Group

UK . 658 parts In-Stock

1+ parts

$59.069

100+ parts

$56.116

1k+ parts

$53.162

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658

$59.069

$56.116

$53.162

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Corphita

USA . 2,241 parts In-Stock

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2,241

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Perfect Parts

USA . 1,254 parts In-Stock

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1,254

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Overview

Unlock the power of digital signal processing with the TMS320C6416TBGLZA6 by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This DSP offers integrated cache, high clock frequency, and multiple timers, making it ideal for a wide range of applications. From audio processing to telecommunications, this versatile chip provides unmatched performance and efficiency. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Experience the value and benefits of the TMS320C6416TBGLZA6 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the DSP, ensuring a longer lifespan.

Integrated Cache: YES

Integrated cache helps in improving processing speed by storing frequently accessed data, reducing access time.

Maximum Supply Voltage: 1.16 V

Higher maximum supply voltage allows for better performance and stability under varying voltage conditions.

Address Bus Width: 23

23-bit address bus width enables the DSP to access a larger range of memory locations for data storage and retrieval.

Bit Size: 32

32-bit architecture allows for faster processing speeds and handling of larger data sets.

Power Supplies (V): 1.1,3.3

Multiple power supply options ensure compatibility with different voltage requirements and environments.

No. of Terminals: 532

Higher number of terminals provide more connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Various package styles offer flexibility in mounting options and heat dissipation for optimal performance.

Minimum Supply Voltage: 1.05 V

Lower minimum supply voltage helps in reducing power consumption and extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

Wide operating temperature range ensures reliable performance in harsh environmental conditions.

No. of External Interrupts: 4

Multiple external interrupts allow for efficient handling of external events and real-time processing tasks.

Minimum Operating Temperature: -40 °C

Ability to operate in extremely cold temperatures makes this DSP suitable for various industrial applications.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and reliability in PCB assembly processes.

No. of Timers: 3

Multiple timers enable the DSP to manage and synchronize time-critical operations for precise control.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6416TBGLZA6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6416TBGLZA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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