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TMS320C6415TBGLZ7

Texas Instruments

TMS320C6415TBGLZ7 by Texas Instruments

TMS320C6415TBGLZ7 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75 MHz. Ideal for digital signal processing applications requiring high-speed performance in a compact package.

Median Price

$172.486

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Rochester

USA . 771 parts In-Stock

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$158.610

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$149.090

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$139.580

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DigiKey

USA . 771 parts In-Stock

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Verical

USA . 761 parts In-Stock

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$186.363

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$174.475

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761

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$174.475

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Digiode

USA . 2,238 parts In-Stock

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$164.968

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DigiKey Marketplace

USA . 771 parts In-Stock

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$167.230

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Vyrian

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Classic Components Corporation

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Semi Source

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Corohmni

South Africa . 55 parts In-Stock

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$35.755

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Parana Technologies

USA . 243 parts In-Stock

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$69.282

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DigiPath Technology Company

USA . 2,236 parts In-Stock

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$76.288

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$70.185

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ChromeModa Solutions

Germany . 5,692 parts In-Stock

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$77.845

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$63.833

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$63.833

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IDEA Electronic Components Group

UK . 1,226 parts In-Stock

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$77.845

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$73.953

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$70.060

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Corphita

USA . 3,516 parts In-Stock

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Microchip USA

USA . 1,598 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Kepictronics

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Overview

Unleash the power of cutting-edge technology with the TMS320C6415TBGLZ7 by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability in their products. The TMS320C6415TBGLZ7 falls under the category of Digital Signal Processors (DSPs), making it perfect for applications requiring high-speed signal processing. Experience seamless performance and efficiency with integrated cache, multiple power supplies, and a wide range of terminals for versatile connectivity. Elevate your projects to the next level with this advanced DSP that offers unmatched value and benefits to customers seeking precision and speed in their applications.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache helps to improve the performance of the DSP by storing frequently accessed data close to the processor, reducing memory access time.

Maximum Clock Frequency: 75 MHz

The high maximum clock frequency allows for faster processing of signal data, making this DSP suitable for applications that require real-time signal processing.

RAM Words: 262144

With a large RAM capacity, this DSP can handle complex signal processing tasks and store a significant amount of data without the need for external memory.

Technology: CMOS

Being based on CMOS technology makes this DSP power-efficient and suitable for low-power applications, extending the battery life of devices it is used in.

ROM Programmability: FLASH

The ability to program the ROM using FLASH technology allows for flexibility in updating firmware or software, making the DSP adaptable to changing signal processing requirements.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6415TBGLZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6415TBGLZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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