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TMS320C6414TGLZ6

Texas Instruments

TMS320C6414TGLZ6 by Texas Instruments

TMS320C6414TGLZ6 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and operates at max frequency of 75 MHz. Ideal for digital signal processing applications requiring high-speed computations in a compact form factor.

Median Price

$83.806

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$72.700

1k+ parts

$65.050

10k+ parts

$61.220

15

-

$72.700

$65.050

$61.220

DigiKey

USA . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

Verical

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$94.912

1k+ parts

$85.825

10k+ parts

-

15

-

$94.912

$85.825

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 366 parts In-Stock

1+ parts

$76.741

100+ parts

-

1k+ parts

-

10k+ parts

-

366

$76.741

-

-

-

Vyrian

USA . 4,538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,538

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 757 parts In-Stock

1+ parts

$69.803

100+ parts

-

1k+ parts

-

10k+ parts

-

757

$69.803

-

-

-

Parana Technologies

USA . 211 parts In-Stock

1+ parts

$71.623

100+ parts

-

1k+ parts

-

10k+ parts

-

211

$71.623

-

-

-

Corphita

USA . 4,059 parts In-Stock

1+ parts

$72.702

100+ parts

-

1k+ parts

-

10k+ parts

-

4,059

$72.702

-

-

-

ChromeModa Solutions

Germany . 1,838 parts In-Stock

1+ parts

$80.475

100+ parts

$65.990

1k+ parts

-

10k+ parts

-

1,838

$80.475

$65.990

-

-

IDEA Electronic Components Group

UK . 1,000 parts In-Stock

1+ parts

$80.475

100+ parts

$76.451

1k+ parts

$72.428

10k+ parts

-

1,000

$80.475

$76.451

$72.428

-

Component Stockers USA

USA . 29 parts In-Stock

1+ parts

$83.180

100+ parts

-

1k+ parts

-

10k+ parts

-

29

$83.180

-

-

-

Microchip USA

USA . 1,731 parts In-Stock

1+ parts

$124.840

100+ parts

$122.670

1k+ parts

$121.580

10k+ parts

$120.500

1,731

$124.840

$122.670

$121.580

$120.500

DigiPath Technology Company

USA . 2,075 parts In-Stock

1+ parts

-

100+ parts

$72.556

1k+ parts

-

10k+ parts

-

2,075

-

$72.556

-

-

Overview

Unlock the power of digital signal processing with the TMS320C6414TGLZ6 from Texas Instruments. This cutting-edge DSP offers unmatched quality and reliability, backed by the renowned reputation of its manufacturer. Ideal for applications in telecommunications, audio processing, and more, this DSP delivers superior performance and efficiency. Experience the value and benefits of seamless signal processing with the TMS320C6414TGLZ6, setting a new standard in digital processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the product easier to handle and less expensive to manufacture.

Surface Mount: YES

Surface mounting allows for easy integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.16 V

Higher supply voltage allows for faster processing speeds and better performance.

Address Bus Width: 23

Wider address bus width allows for more memory addressing capabilities, enhancing the product's processing capabilities.

Package Shape: SQUARE

Square package shape is versatile and allows for efficient use of space on a PCB.

Bit Size: 32

32-bit architecture provides higher processing power and improved performance.

Power Supplies (V): 1.1, 3.3

Multiple power supply options allow for flexibility in different applications and power requirements.

No. of Terminals: 532

A high number of terminals enable a greater degree of connectivity and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch package style offer high density integration and improved signal reliability.

Minimum Supply Voltage: 1.05 V

Lower minimum supply voltage contributes to energy efficiency and prolongs battery life.

Maximum Operating Temperature: 90 °C

High maximum operating temperature ensures reliable performance in extreme conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in a wide range of environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing of signals.

Maximum Seated Height: 3.25 mm

Low seated height makes the product suitable for compact designs and space-constrained applications.

RAM Words: 16384

Large RAM capacity enables efficient data processing and storage.

Width: 23 mm

Compact width allows for space-saving PCB layout and integration into tight spaces.

Boundary Scan: YES

Boundary scan feature aids in debugging, testing, and verifying the integrity of connections on the PCB.

External Data Bus Width: 64

Wide external data bus width facilitates faster data transfer and processing speeds.

Maximum Clock Frequency: 75 MHz

High clock frequency enables fast data processing and execution of instructions.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and efficiency within the processor.

Length: 23 mm

Compact length allows for space-efficient PCB layout and integration into small form factor devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type allows for a wide range of applications and functionalities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall product efficiency.

Terminal Form: BALL

Ball terminal form provides reliable connections and ease of soldering during assembly.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage ensures consistent and reliable performance of the processor.

Terminal Pitch: 0.8 mm

Small terminal pitch enables high-density mounting and compact PCB designs.

Format: FIXED POINT

Fixed-point format allows for efficient computation with integer data types, enhancing performance in certain applications.

Low Power Mode: YES

Low power mode option helps in conserving energy and extending battery life, making the product more energy-efficient.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6414TGLZ6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

532

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6414TGLZ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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