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TMS320C6414TBGLZA6

Texas Instruments

TMS320C6414TBGLZA6 by Texas Instruments

TMS320C6414TBGLZA6 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and 75 MHz max clock frequency. Ideal for industrial applications requiring high-speed signal processing in a compact package with low power mode support.

Median Price

$147.744

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 373 parts In-Stock

1+ parts

$114.919

100+ parts

$111.462

1k+ parts

$86.405

10k+ parts

-

373

$114.919

$111.462

$86.405

-

Mouser Electronics

USA . 17 parts In-Stock

1+ parts

$180.570

100+ parts

$138.800

1k+ parts

-

10k+ parts

-

17

$180.570

$138.800

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,137 parts In-Stock

1+ parts

$109.173

100+ parts

-

1k+ parts

-

10k+ parts

-

4,137

$109.173

-

-

-

Vyrian

USA . 7,125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,125

-

-

-

-

Chip Stock

USA . 2,510 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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2,510

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,182 parts In-Stock

1+ parts

$37.444

100+ parts

-

1k+ parts

-

10k+ parts

-

2,182

$37.444

-

-

-

DigiPath Technology Company

USA . 776 parts In-Stock

1+ parts

$41.231

100+ parts

$37.932

1k+ parts

-

10k+ parts

-

776

$41.231

$37.932

-

-

ChromeModa Solutions

Germany . 6,372 parts In-Stock

1+ parts

$42.072

100+ parts

$34.499

1k+ parts

-

10k+ parts

-

6,372

$42.072

$34.499

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-

IDEA Electronic Components Group

UK . 1,568 parts In-Stock

1+ parts

$42.072

100+ parts

$39.968

1k+ parts

$37.865

10k+ parts

-

1,568

$42.072

$39.968

$37.865

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Corohmni

South Africa . 243 parts In-Stock

1+ parts

$67.584

100+ parts

-

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243

$67.584

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Ampacity Inc.

Singapore . 209 parts In-Stock

1+ parts

$97.680

100+ parts

-

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209

$97.680

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Corphita

USA . 4,493 parts In-Stock

1+ parts

$103.427

100+ parts

-

1k+ parts

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4,493

$103.427

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Perfect Parts

USA . 80 parts In-Stock

1+ parts

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80

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Overview

Experience the cutting-edge technology of the TMS320C6414TBGLZA6 by Texas Instruments, a top-tier manufacturer known for quality and innovation. This digital signal processor (DSP) offers unparalleled performance and efficiency in a wide range of applications. With integrated cache, multiple power supplies, and boundary scan capability, this product delivers exceptional value and benefits to customers seeking high-speed processing and seamless functionality. Trust Texas Instruments to provide you with the tools you need to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product long-lasting and affordable.

Integrated Cache: YES

Having an integrated cache improves processing speed by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.16 V

Operates efficiently within the specified voltage range, ensuring reliable performance.

Address Bus Width: 23

A wider address bus allows for efficient memory addressing and data movement.

Package Shape: SQUARE

The square package shape optimizes the use of space, making it suitable for compact electronic devices.

Bit Size: 32

With a higher bit size, the product can handle larger data sets and perform complex calculations with precision.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, providing flexibility in different operating environments.

No. of Terminals: 532

Having a high number of terminals allows for connectivity with various external components and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enhances connectivity and facilitates high-density mounting on PCBs.

Minimum Supply Voltage: 1.05 V

The lower minimum supply voltage ensures energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand elevated heat conditions without thermal issues.

No. of External Interrupts: 4

Having external interrupts allows the processor to quickly respond to external events, improving real-time processing capabilities.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the product remains operational even in extreme cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures reliable solder connections and prevents oxidation for long-term usability.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and facilitates efficient heat dissipation.

Maximum Seated Height: 3.25 mm

The compact maximum seated height enables the product to be installed in thin-profile devices without compromising space.

RAM Words: 16384

With a large RAM capacity, the product can store and access a significant amount of data for processing.

Width: 23 mm

The compact width makes the product suitable for small form factor devices and space-constrained applications.

Boundary Scan: YES

Boundary scan feature allows for testing and debugging of the product during production, ensuring quality control.

External Data Bus Width: 64

A wider external data bus allows for faster data transfer between the processor and external memory or peripherals.

Maximum Clock Frequency: 75 MHz

The high maximum clock frequency enables fast data processing and efficient performance in demanding applications.

Peak Reflow Temperature °C: 220

The high peak reflow temperature ensures reliable solder connections during manufacturing processes.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and communication within the processor, improving overall performance.

Length: 23 mm

The balanced length ensures the product fits well within standard PCB layouts and enclosure designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range, the product can operate reliably in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type offers specialized processing capabilities for digital signal processing tasks and other applications.

No. of Timers: 3

Multiple timers allow for accurate timing functions, scheduling tasks, and event handling in real-time applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable performance for efficient operation.

Terminal Form: BALL

The ball terminal form facilitates soldering and rework processes, ensuring secure connections and easy maintenance.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage optimizes power efficiency and performance for stable operation under typical conditions.

No. of DMA Channels: 64

Having a high number of DMA channels allows for efficient data transfer between memory and peripherals without CPU intervention.

ROM Programmability: FLASH

Flash ROM programmability enables firmware updates and customization, enhancing the product's flexibility and adaptability.

Terminal Pitch: 0.8 mm

The fine terminal pitch simplifies PCB routing, reduces signal interference, and facilitates high-density mounting.

Format: FIXED POINT

Using fixed-point format simplifies arithmetic operations and programming, enhancing computational efficiency.

Moisture Sensitivity Level (MSL): 4

MSL 4 designation ensures proper handling and storage to prevent moisture-related damage during manufacturing and assembly.

Low Power Mode: YES

Support for low power mode enables energy-efficient operation, prolonging battery life and reducing overall power consumption.

On Chip Program ROM Width: 8

The 8-bit width of on-chip program ROM simplifies address calculations and access, improving program execution efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6414TBGLZA6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6414TBGLZA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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