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TMS320C6412GDK600

Texas Instruments

TMS320C6412GDK600 by Texas Instruments

TMS320C6412GDK600 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at max 75.19 MHz clock frequency. Ideal for digital signal processing applications, it features 262144 RAM words and low power mode support. With a package style of grid array and fine pitch, this CMOS technology-based processor has a terminal pitch of 0.8 mm.

Median Price

$72.885

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 140 parts In-Stock

1+ parts

$67.020

100+ parts

$63.000

1k+ parts

$56.970

10k+ parts

-

140

$67.020

$63.000

$56.970

-

DigiKey

USA . 140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

140

-

-

-

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Verical

USA . 80 parts In-Stock

1+ parts

-

100+ parts

$78.750

1k+ parts

$71.213

10k+ parts

-

80

-

$78.750

$71.213

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,869 parts In-Stock

1+ parts

$63.669

100+ parts

-

1k+ parts

-

10k+ parts

-

2,869

$63.669

-

-

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DigiKey Marketplace

USA . 140 parts In-Stock

1+ parts

$69.700

100+ parts

-

1k+ parts

-

10k+ parts

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140

$69.700

-

-

-

Vyrian

USA . 6,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,715

-

-

-

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Cyclops Electronics Ltd

UK . 39 parts In-Stock

1+ parts

-

100+ parts

-

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39

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 83 parts In-Stock

1+ parts

$22.813

100+ parts

$20.760

1k+ parts

$18.707

10k+ parts

-

83

$22.813

$20.760

$18.707

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Corphita

USA . 322 parts In-Stock

1+ parts

$60.318

100+ parts

-

1k+ parts

-

10k+ parts

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322

$60.318

-

-

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Parana Technologies

USA . 1,112 parts In-Stock

1+ parts

$62.700

100+ parts

-

1k+ parts

-

10k+ parts

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1,112

$62.700

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-

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Component Stockers USA

USA . 311 parts In-Stock

1+ parts

$68.940

100+ parts

$64.800

1k+ parts

-

10k+ parts

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311

$68.940

$64.800

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DigiPath Technology Company

USA . 2,029 parts In-Stock

1+ parts

$69.040

100+ parts

$63.517

1k+ parts

-

10k+ parts

-

2,029

$69.040

$63.517

-

-

ChromeModa Solutions

Germany . 430 parts In-Stock

1+ parts

$70.449

100+ parts

$57.768

1k+ parts

-

10k+ parts

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430

$70.449

$57.768

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IDEA Electronic Components Group

UK . 139 parts In-Stock

1+ parts

$70.449

100+ parts

$66.927

1k+ parts

$63.404

10k+ parts

-

139

$70.449

$66.927

$63.404

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Corohmni

South Africa . 14 parts In-Stock

1+ parts

$75.123

100+ parts

-

1k+ parts

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14

$75.123

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-

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Microchip USA

USA . 377 parts In-Stock

1+ parts

-

100+ parts

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377

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Overview

Experience unparalleled performance and efficiency with the TMS320C6412GDK600 by Texas Instruments. As a leading manufacturer of Digital Signal Processors (DSPs), Texas Instruments delivers top-notch quality and reliability in every product. This DSP offers a wide range of applications, making it a versatile solution for various industries. With its high-speed processing capabilities and low power consumption, this product provides exceptional value and benefits to customers looking for cutting-edge technology. Upgrade your system today with the TMS320C6412GDK600 and enjoy the advantages of superior performance and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the components inside the package, making the product long-lasting.

Surface Mount: YES

The surface mount feature makes installation easier and more efficient, saving time and effort during setup.

Maximum Supply Voltage: 1.44 V

With a high maximum supply voltage, this product can handle power fluctuations and ensure reliable performance.

Address Bus Width: 23

A wide address bus width allows for efficient data transfer and processing, improving overall performance.

Package Shape: SQUARE

The square package shape makes it easier to mount and fit in various electronic devices, increasing versatility.

Bit Size: 32

A 32-bit size enables the product to handle complex calculations and processes, making it suitable for demanding applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages gives flexibility in powering the product in different environments and conditions.

No. of Terminals: 548

A high number of terminals allows for connectivity to various external components, expanding the product's usability.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style offers a compact form factor and efficient layout for optimized performance.

Minimum Supply Voltage: 1.36 V

A low minimum supply voltage ensures energy efficiency and helps in reducing power consumption.

Terminal Finish: TIN LEAD

The tin lead terminal finish enhances connectivity and ensures reliable electrical contact for stable operation.

Terminal Position: BOTTOM

Bottom terminal position allows for easy access and connection, simplifying installation and maintenance.

Maximum Seated Height: 2.8 mm

A low maximum seated height enables the product to be accommodated in tight spaces or slim devices, increasing application flexibility.

RAM Words: 262144

With a large RAM capacity, the product can store and process a significant amount of data efficiently, enhancing performance.

Width: 23 mm

A compact width dimension makes the product space-efficient and suitable for integration into various electronic systems.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the product, improving reliability and ease of maintenance.

External Data Bus Width: 64

A wide external data bus width enables fast data transfer and communication with external devices, enhancing overall system speed.

Maximum Clock Frequency: 75.19 MHz

High maximum clock frequency ensures quick processing speed and responsiveness, making the product suitable for real-time applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture provides efficient data flow and organization, enhancing overall performance and response times.

Length: 23 mm

A compact length dimension makes the product suitable for use in space-constrained applications and devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The digital signal processor and other peripheral IC types offer versatile functionality for a wide range of signal processing tasks and applications.

Technology: CMOS

CMOS technology provides low power consumption and high efficiency, making the product energy-efficient and cost-effective.

Terminal Form: BALL

The ball terminal form ensures secure connections and stability, reducing the risk of disconnections or interruptions during operation.

Nominal Supply Voltage: 1.4 V

Stable nominal supply voltage ensures consistent and reliable performance of the product under varying operating conditions.

Terminal Pitch: 0.8 mm

A small terminal pitch contributes to compact design and efficient layout, making the product suitable for space-constrained applications.

Format: FIXED POINT

Fixed point format simplifies arithmetic operations and optimizations, making the product efficient for numerical calculations and signal processing tasks.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates a moderate level of moisture sensitivity, ensuring the product's reliability and durability under normal environmental conditions.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and reduces power consumption, making the product suitable for battery-powered or energy-efficient applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6412GDK600 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6412GDK600 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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