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TMS320C6412AGNZA5

Texas Instruments

TMS320C6412AGNZA5 by Texas Instruments

TMS320C6412AGNZA5 by Texas Instruments is a 32-bit DSP with integrated cache, 64 external data bus width, and 75.19 MHz clock frequency. Ideal for industrial applications requiring high-speed processing, it features low power mode and boundary scan capability for efficient performance in digital signal processing tasks.

Median Price

$80.190

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 18 parts In-Stock

1+ parts

$26.960

100+ parts

-

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18

$26.960

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Chip1Stop

Japan . 18 parts In-Stock

1+ parts

$61.300

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-

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18

$61.300

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Texas Instruments

USA . 2,784 parts In-Stock

1+ parts

$85.340

100+ parts

$75.858

1k+ parts

$55.778

10k+ parts

-

2,784

$85.340

$75.858

$55.778

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Rochester

USA . 227 parts In-Stock

1+ parts

-

100+ parts

$80.190

1k+ parts

$71.750

10k+ parts

$67.530

227

-

$80.190

$71.750

$67.530

DigiKey

USA . 227 parts In-Stock

1+ parts

-

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227

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Verical

USA . 170 parts In-Stock

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$91.513

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170

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$91.513

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-

Distributors (In-Stock)

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Digiode

USA . 4,805 parts In-Stock

1+ parts

$44.213

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-

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4,805

$44.213

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$67.210

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650

$67.210

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Vyrian

USA . 6,700 parts In-Stock

1+ parts

-

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6,700

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PC Components Company LLC

USA . 114 parts In-Stock

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114

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Bristol Electronics

USA . 114 parts In-Stock

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114

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Connect4Technologies Inc.

Canada . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,579 parts In-Stock

1+ parts

$24.046

100+ parts

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2,579

$24.046

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Corphita

USA . 3,533 parts In-Stock

1+ parts

$41.886

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3,533

$41.886

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$61.083

100+ parts

$55.586

1k+ parts

$50.088

10k+ parts

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3,000

$61.083

$55.586

$50.088

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$67.210

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1,000

$67.210

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Parana Technologies

USA . 2,039 parts In-Stock

1+ parts

$72.389

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2,039

$72.389

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ChromeModa Solutions

Germany . 1,589 parts In-Stock

1+ parts

$81.336

100+ parts

$66.696

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1,589

$81.336

$66.696

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IDEA Electronic Components Group

UK . 512 parts In-Stock

1+ parts

$81.336

100+ parts

$77.269

1k+ parts

$73.202

10k+ parts

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512

$81.336

$77.269

$73.202

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Ampacity Inc.

Singapore . 388 parts In-Stock

1+ parts

$86.100

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388

$86.100

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Microchip USA

USA . 1,454 parts In-Stock

1+ parts

$175.114

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1,454

$175.114

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DigiPath Technology Company

USA . 682 parts In-Stock

1+ parts

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$73.333

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682

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$73.333

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Overview

Experience unparalleled performance and efficiency with the Texas Instruments TMS320C6412AGNZA5 digital signal processor. Manufactured by a trusted industry leader, this DSP offers cutting-edge technology for a wide range of applications. From audio processing to telecommunications, this powerful processor delivers high-quality results with integrated cache and low power mode. Trust in Texas Instruments to provide you with a reliable and versatile solution that exceeds expectations. Elevate your projects with the TMS320C6412AGNZA5 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, making the product ideal for high-performance tasks.

Maximum Supply Voltage: 1.44 V

The high maximum supply voltage allows for flexibility in power management and operation.

Address Bus Width: 23

A wider address bus width enables efficient memory access and data processing capabilities.

Bit Size: 32

A 32-bit architecture provides enhanced computational capabilities for handling complex algorithms and data.

No. of Terminals: 548

With a large number of terminals, the product can accommodate multiple input and output connections for versatile connectivity.

Maximum Clock Frequency: 75.19 MHz

The high maximum clock frequency allows for fast data processing and real-time operation, making it suitable for time-critical applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6412AGNZA5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6412AGNZA5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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