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TMS320C6205DGHK200

Texas Instruments

TMS320C6205DGHK200 by Texas Instruments

TMS320C6205DGHK200 by Texas Instruments is a 32-bit DSP with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 200 MHz, making it ideal for digital signal processing applications requiring high-speed performance in a compact package. With low power mode and multiple internal bus architecture, this DSP offers efficient processing capabilities for various electronic devices.

Median Price

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Lifecycle Status

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1k+

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Vyrian

USA . 6,858 parts In-Stock

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Digiode

USA . 3,008 parts In-Stock

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Ampacity Inc.

Singapore . 974 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 667 parts In-Stock

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$9.389

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One Stop Electronics

USA . 1,417 parts In-Stock

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Parana Technologies

USA . 1,952 parts In-Stock

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$28.157

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DigiPath Technology Company

USA . 585 parts In-Stock

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$34.449

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$31.693

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ChromeModa Solutions

Germany . 3,871 parts In-Stock

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$35.152

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$28.825

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IDEA Electronic Components Group

UK . 938 parts In-Stock

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$33.394

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$31.637

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Corohmni

South Africa . 194 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,082 parts In-Stock

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Microchip USA

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Kepictronics

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

USA . 3,784 parts In-Stock

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Corphita

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Perfect Parts

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GreenTree Electronics

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments TMS320C6205DGHK200 Digital Signal Processor. Crafted with precision and expertise, this high-quality DSP offers unparalleled performance in a wide range of applications. From advanced audio processing to complex control systems, this versatile chip delivers exceptional value and benefits to customers seeking top-notch solutions. Elevate your projects to new heights with the TMS320C6205DGHK200 and experience the advantage of superior quality and innovation from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a durable and lightweight package for the DSP, making it easy to handle and transport.

Integrated Cache: YES

The integrated cache helps improve performance by storing frequently accessed data, reducing the need to fetch data from the main memory.

Maximum Supply Voltage: 1.57 V

The maximum supply voltage ensures stable operation and prevents damage to the DSP, enhancing its longevity.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster data processing and storage, improving the overall performance of the DSP.

Address Bus Width: 32

A wider address bus width enables the DSP to access a larger memory space, enhancing its capabilities in handling complex algorithms and data structures.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, making it easier to integrate the DSP into various electronic devices.

Bit Size: 32

A larger bit size allows the DSP to process larger chunks of data at a time, leading to faster computations and improved performance.

Power Supplies (V): 1.5,3.3,5

The availability of multiple power supply options gives flexibility in designing power-efficient systems using the DSP.

No. of Terminals: 288

With a high number of terminals, the DSP can interface with a wide range of peripherals and external components, expanding its functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style options provide versatility in mounting and soldering the DSP onto a PCB, catering to different design requirements.

Minimum Supply Voltage: 1.43 V

The minimum supply voltage ensures that the DSP can operate reliably even under low voltage conditions, enhancing its stability.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range allows the DSP to function in a variety of environments without the risk of overheating.

No. of External Interrupts: 4

Having multiple external interrupts enables the DSP to respond quickly to external events, enhancing its real-time processing capabilities.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range ensures that the DSP can function reliably even in cold environments, making it versatile for various applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and conductivity, ensuring a secure connection between the DSP and the PCB.

Terminal Position: BOTTOM

The bottom terminal position allows for easier PCB layout and routing, simplifying the integration of the DSP into electronic systems.

Maximum Seated Height: 1.4 mm

The low seated height profile of the DSP package saves space on the PCB and enables slim device designs.

RAM Words: 16384

With a large RAM capacity, the DSP can store and manipulate a significant amount of data for complex signal processing tasks.

Width: 16 mm

The compact width of the DSP package allows for efficient use of space on the PCB, enabling compact and portable device designs.

Boundary Scan: YES

The boundary scan feature facilitates debugging and testing of the DSP during manufacturing and maintenance, improving overall product quality.

External Data Bus Width: 32

A wide external data bus width enables fast data transfer between the DSP and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 200 MHz

The high clock frequency allows the DSP to process data quickly and efficiently, making it suitable for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 20

The short time required at peak reflow temperature during assembly ensures that the DSP remains undamaged and reliable during the manufacturing process.

Peak Reflow Temperature °C: 220

The high peak reflow temperature tolerance indicates the robustness of the DSP package during the assembly process, ensuring reliable solder joints.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for efficient data transfer within the DSP, enhancing its overall processing speed and performance.

Length: 16 mm

The small length of the DSP package contributes to its compact and space-efficient design, enabling integration into various electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of digital signal processor peripherals enhances the DSP's capabilities for handling signal processing tasks in diverse applications.

No. of Timers: 2

Having multiple timers allows the DSP to schedule and execute time-sensitive operations effectively, enhancing its versatility in real-time applications.

Technology: CMOS

Utilizing CMOS technology allows the DSP to operate efficiently with low power consumption, making it suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides a reliable and robust connection between the DSP and the PCB, ensuring stable signal transmission and data processing.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage specification ensures that the DSP operates within safe voltage limits, preventing damage to the device.

No. of DMA Channels: 4

Having multiple DMA channels allows the DSP to efficiently transfer data between peripherals and memory, optimizing system performance.

Terminal Pitch: 0.8 mm

The small terminal pitch facilitates high-density mounting of the DSP on the PCB, enabling compact system designs.

Format: FIXED POINT

Utilizing fixed-point format simplifies the arithmetic operations performed by the DSP, enabling efficient signal processing with reduced computational complexity.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level indicates the device's robustness against moisture exposure during manufacturing and storage, ensuring long-term reliability.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient state, extending battery life in portable devices and reducing overall energy consumption.

On Chip Program ROM Width: 8

With on-chip program ROM, the DSP can store firmware and program code internally, enabling quick and efficient execution of instructions for signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6205DGHK200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3.3,5

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6205DGHK200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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