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TMS320C6204GWTA200

Texas Instruments

TMS320C6204GWTA200 by Texas Instruments

TMS320C6204GWTA200 by Texas Instruments is a 32-bit DSP with 288 terminals, operating at max 200 MHz. It features integrated cache, 8-bit data RAM width, and 22-bit address bus width. Ideal for industrial applications requiring high-speed signal processing in compact form factor.

Median Price

$24.420

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 90 parts In-Stock

1+ parts

$24.420

100+ parts

$19.230

1k+ parts

$17.460

10k+ parts

$15.660

90

$24.420

$19.230

$17.460

$15.660

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,925 parts In-Stock

1+ parts

$23.199

100+ parts

-

1k+ parts

-

10k+ parts

-

4,925

$23.199

-

-

-

Vyrian

USA . 2,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,479

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,679 parts In-Stock

1+ parts

$21.978

100+ parts

-

1k+ parts

-

10k+ parts

-

3,679

$21.978

-

-

-

Microchip USA

USA . 2,033 parts In-Stock

1+ parts

$25.680

100+ parts

$25.310

1k+ parts

$25.130

10k+ parts

$24.940

2,033

$25.680

$25.310

$25.130

$24.940

Corohmni

South Africa . 286 parts In-Stock

1+ parts

$55.364

100+ parts

-

1k+ parts

-

10k+ parts

-

286

$55.364

-

-

-

Parana Technologies

USA . 48 parts In-Stock

1+ parts

$62.959

100+ parts

-

1k+ parts

-

10k+ parts

-

48

$62.959

-

-

-

DigiPath Technology Company

USA . 1,163 parts In-Stock

1+ parts

$69.326

100+ parts

$63.780

1k+ parts

-

10k+ parts

-

1,163

$69.326

$63.780

-

-

ChromeModa Solutions

Germany . 3,095 parts In-Stock

1+ parts

$70.741

100+ parts

$58.008

1k+ parts

-

10k+ parts

-

3,095

$70.741

$58.008

-

-

IDEA Electronic Components Group

UK . 1,031 parts In-Stock

1+ parts

$70.741

100+ parts

$67.204

1k+ parts

$63.667

10k+ parts

-

1,031

$70.741

$67.204

$63.667

-

Overview

Experience unparalleled performance and reliability with the TMS320C6204GWTA200 by Texas Instruments, a leading manufacturer in digital signal processors. This cutting-edge product offers integrated cache, multiple external interrupts, and low power mode, making it ideal for various applications in industries such as telecommunications, audio processing, and automotive systems. With a maximum clock frequency of 200 MHz and a wide range of features, this DSP provides exceptional value and benefits to customers seeking top-notch quality and efficiency in their designs. Trust Texas Instruments to deliver excellence with the TMS320C6204GWTA200.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, ensuring reliable performance in various environments.

Integrated Cache: YES

The integrated cache enhances the processing speed and efficiency of the DSP, allowing for faster data retrieval and execution.

Maximum Supply Voltage: 1.57 V

The higher supply voltage allows for increased performance capability and flexibility in power management.

On Chip Data RAM Width: 8

The wider data RAM width enables the DSP to handle larger amounts of data simultaneously, improving overall processing efficiency.

Address Bus Width: 22

The wider address bus width facilitates efficient memory addressing and data retrieval operations, enhancing the DSP's overall performance.

Bit Size: 32

The 32-bit architecture enables the DSP to handle complex calculations and processes with higher precision and accuracy, making it suitable for demanding applications.

No. of Terminals: 288

The high number of terminals provides ample connectivity options, allowing the DSP to interface with a wide range of external devices and peripherals.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures that the DSP can perform reliably in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the DSP to function effectively in cold environments without compromising its performance or longevity.

Maximum Clock Frequency: 200 MHz

The high maximum clock frequency allows the DSP to execute instructions and process data at a rapid rate, making it suitable for real-time applications and high-speed computations.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6204GWTA200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

290 mA

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6204GWTA200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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