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TMS320C6202GJL250

Texas Instruments

TMS320C6202GJL250 by Texas Instruments

TMS320C6202GJL250 by Texas Instruments is a 32-bit DSP with 22-bit address bus, clocked at 250 MHz. It features 32768 RAM words and operates on supply voltages of 1.71V to 3.3V. Ideal for digital signal processing applications requiring high-speed data processing in compact form factors.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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Digiode

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Cyclops Electronics Ltd

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ACDS - Activité Composants Distribution Service

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One Stop Electronics

USA . 1,105 parts In-Stock

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AZTECH Wire

Italy . 755 parts In-Stock

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Corohmni

South Africa . 2,871 parts In-Stock

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Parana Technologies

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ChromeModa Solutions

Germany . 2,309 parts In-Stock

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IDEA Electronic Components Group

UK . 1,169 parts In-Stock

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Microchip USA

USA . 2,224 parts In-Stock

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Corphita

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GreenTree Electronics

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DigiPath Technology Company

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Overview

Unlock the power of digital signal processing with the TMS320C6202GJL250 by Texas Instruments. Designed with precision and expertise, this DSP offers unparalleled performance and reliability for a wide range of applications. Whether you're working on audio processing, telecommunications, or industrial control systems, this high-quality device delivers exceptional value and efficiency. Experience seamless integration, enhanced capabilities, and superior results with the TMS320C6202GJL250. Elevate your projects to new heights with Texas Instruments at your side.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the DSP.

Surface Mount: YES

Being surface mountable makes the installation of this DSP easier and more convenient, especially in compact electronic devices.

Maximum Supply Voltage: 1.89 V

The maximum supply voltage of 1.89 V provides a safe operating range for the DSP, protecting it from potential damage due to high voltage input.

Address Bus Width: 22

With a wider address bus width of 22, the DSP can handle larger amounts of data and addresses, making it suitable for complex signal processing tasks.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, making it easier to integrate the DSP into a variety of electronic devices.

Bit Size: 32

A 32-bit size allows for high precision and accuracy in signal processing, making this DSP ideal for applications requiring detailed calculations and data processing.

Power Supplies (V): 1.8,3.3

Having multiple power supply options of 1.8V and 3.3V provides flexibility in designing and powering the DSP in different electronic systems.

No. of Terminals: 352

With a large number of terminals, the DSP can easily connect to other components, enabling effective communication and data exchange within the system.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The package style of grid array with heat sink/slug offers efficient heat dissipation, ensuring optimal performance and longevity of the DSP.

Minimum Supply Voltage: 1.71 V

The minimum supply voltage of 1.71 V guarantees the DSP can function reliably within a specified voltage range, preventing damage from insufficient power.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good conductivity and solderability, facilitating secure connections and stable performance of the DSP.

Terminal Position: BOTTOM

The bottom terminal position eases installation and maintenance of the DSP in electronic devices, offering convenience and accessibility to the connectors.

Maximum Seated Height: 3.8 mm

With a maximum seated height of 3.8 mm, this DSP can fit into compact spaces without compromising on its performance or functionality.

RAM Words: 32768

The presence of 32768 RAM words allows for efficient data storage and retrieval, enhancing the processing speed and capabilities of the DSP.

Width: 27 mm

A width of 27 mm provides a balance between compact size and functionality, making this DSP suitable for a range of electronic applications.

Boundary Scan: YES

The presence of boundary scan capability enables easy testing and debugging of the DSP, ensuring reliable performance and quick problem identification.

External Data Bus Width: 32

A 32-bit external data bus width allows for high-speed data transfer and processing, making this DSP suitable for demanding signal processing tasks.

Maximum Clock Frequency: 250 MHz

With a maximum clock frequency of 250 MHz, this DSP can handle high-speed operations and real-time processing, meeting the requirements of advanced applications.

Maximum Time At Peak Reflow Temperature (s): 20

A maximum time of 20 seconds at peak reflow temperature of 220°C ensures the DSP can withstand soldering processes without damage, ensuring reliable performance.

Peak Reflow Temperature °C: 220

The peak reflow temperature of 220°C indicates the robustness and thermal stability of the DSP during soldering, guaranteeing its longevity and performance.

Internal Bus Architecture: MULTIPLE

Having multiple internal buses enhances the data flow and processing capabilities of the DSP, enabling it to handle complex computations and tasks efficiently.

Length: 27 mm

A length of 27 mm provides a compact form factor for the DSP, making it suitable for space-constrained electronic devices without compromising on performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor and supporting other peripheral IC types makes this DSP versatile and compatible with a wide range of electronic systems and components.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, making this DSP energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The use of ball terminals simplifies the soldering process and ensures secure connections, enhancing the reliability and longevity of the DSP in electronic systems.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V provides a stable power source for the DSP, ensuring consistent performance and operational efficiency.

Terminal Pitch: 1 mm

A terminal pitch of 1 mm offers easy integration and connection of the DSP with other components, facilitating smooth communication and data exchange within the electronic system.

Format: FIXED POINT

With a fixed-point format, this DSP can perform precise and accurate calculations, making it suitable for applications requiring high computational accuracy and efficiency.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates the robustness of the DSP against moisture exposure, ensuring reliable performance even in humid or damp environments.

Low Power Mode: YES

The availability of a low power mode allows the DSP to operate efficiently while conserving energy, making it an ideal choice for battery-powered or energy-conscious applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6202GJL250 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

250 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

352

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA352,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6202GJL250 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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