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TMS320C6202BGNZ250

Texas Instruments

TMS320C6202BGNZ250 by Texas Instruments

TMS320C6202BGNZ250 by Texas Instruments is a 32-bit DSP with 22-bit address bus, 32-bit external data bus, and operates at max frequency of 250 MHz. Ideal for digital signal processing applications requiring low power consumption and fixed-point format calculations.

Median Price

$76.534

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

489

-

-

-

-

Rochester

USA . 487 parts In-Stock

1+ parts

-

100+ parts

$68.030

1k+ parts

$60.870

10k+ parts

$57.290

487

-

$68.030

$60.870

$57.290

Verical

USA . 393 parts In-Stock

1+ parts

-

100+ parts

$85.037

1k+ parts

$76.088

10k+ parts

$71.612

393

-

$85.037

$76.088

$71.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,704 parts In-Stock

1+ parts

$71.801

100+ parts

-

1k+ parts

-

10k+ parts

-

4,704

$71.801

-

-

-

DigiKey Marketplace

USA . 489 parts In-Stock

1+ parts

$78.600

100+ parts

-

1k+ parts

-

10k+ parts

-

489

$78.600

-

-

-

Vyrian

USA . 3,969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,969

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 810 parts In-Stock

1+ parts

$40.775

100+ parts

-

1k+ parts

-

10k+ parts

-

810

$40.775

-

-

-

DigiPath Technology Company

USA . 1,954 parts In-Stock

1+ parts

$44.899

100+ parts

$41.307

1k+ parts

-

10k+ parts

-

1,954

$44.899

$41.307

-

-

ChromeModa Solutions

Germany . 4,752 parts In-Stock

1+ parts

$45.815

100+ parts

$37.568

1k+ parts

-

10k+ parts

-

4,752

$45.815

$37.568

-

-

IDEA Electronic Components Group

UK . 365 parts In-Stock

1+ parts

$45.815

100+ parts

$43.524

1k+ parts

$41.234

10k+ parts

-

365

$45.815

$43.524

$41.234

-

Corphita

USA . 2,843 parts In-Stock

1+ parts

$68.022

100+ parts

-

1k+ parts

-

10k+ parts

-

2,843

$68.022

-

-

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Corohmni

South Africa . 209 parts In-Stock

1+ parts

$82.628

100+ parts

-

1k+ parts

-

10k+ parts

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209

$82.628

-

-

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Microchip USA

USA . 309 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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309

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Overview

Unlock unparalleled performance and reliability with the TMS320C6202BGNZ250 by Texas Instruments. As a leading manufacturer in the digital signal processor category, Texas Instruments delivers cutting-edge technology that exceeds expectations. This DSP offers exceptional value and benefits to customers across various applications, from telecommunications to audio processing. Experience the advantage of superior quality and advanced features with the TMS320C6202BGNZ250.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.57 V

The maximum supply voltage of 1.57 V ensures that the DSP operates within safe voltage limits, improving reliability.

Address Bus Width: 22

A wider address bus width of 22 allows for increased memory addressing capabilities, enhancing the processing capabilities of the DSP.

Package Shape: SQUARE

The square package shape offers uniformity and ease of mounting on the PCB, making it suitable for automated assembly processes.

Bit Size: 32

A bit size of 32 ensures that the DSP can handle complex digital signal processing tasks with high precision and accuracy.

Power Supplies (V): 1.5,3.3

Multiple power supply options of 1.5 V and 3.3 V provide flexibility in designing various applications with different power requirements.

No. of Terminals: 352

The high number of terminals allows for a greater number of connections, enabling the DSP to interface with multiple external components efficiently.

Package Style (Meter): GRID ARRAY

The grid array package style offers high interconnect density, leading to better signal integrity and improved thermal performance.

Minimum Supply Voltage: 1.43 V

The minimum supply voltage of 1.43 V ensures that the DSP can operate reliably even under low-voltage conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and ensures a reliable electrical connection for long-term performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the DSP into the final product.

Maximum Seated Height: 2.8 mm

The compact maximum seated height of 2.8 mm allows for a low-profile design, ideal for space-constrained applications.

RAM Words: 32768

The large RAM capacity of 32768 words enables the DSP to efficiently store and process data, enhancing its performance in memory-intensive tasks.

Width: 27 mm

The moderate width of 27 mm provides a balance between compact size and adequate space for terminal connections, facilitating ease of integration.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the DSP during manufacturing or maintenance, improving overall product reliability.

External Data Bus Width: 32

An external data bus width of 32 enables high-speed data transfer between the DSP and external memory or peripherals, enhancing processing efficiency.

Maximum Clock Frequency: 250 MHz

The high maximum clock frequency of 250 MHz allows the DSP to perform rapid signal processing tasks, making it suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 20

The short maximum time at peak reflow temperature of 20 seconds minimizes the risk of thermal damage during solder reflow processes, ensuring product reliability.

Peak Reflow Temperature °C: 220

The peak reflow temperature of 220°C ensures proper solder reflow and component bonding, leading to robust connections and long-term performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and processing speed, allowing the DSP to handle complex algorithms efficiently.

Length: 27 mm

The moderate length of 27 mm offers a compact form factor while providing sufficient space for internal components, contributing to a well-balanced design.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor and other components indicates the product's versatility in supporting various digital signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable for long-term operation.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and simplifies the soldering process, ensuring a secure attachment to the PCB.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5 V ensures stable and consistent power delivery to the DSP, contributing to reliable and efficient performance.

Terminal Pitch: 1 mm

The standard terminal pitch of 1 mm allows for easy routing of traces on the PCB, simplifying the layout and assembly process for a quick turnaround.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and reduces computational complexity, making the DSP suitable for real-time signal processing applications.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that the DSP is designed to withstand moderate exposure to moisture during storage and handling, ensuring product reliability.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient state when not performing intensive tasks, prolonging battery life in portable applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6202BGNZ250 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

250 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

352

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA352,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6202BGNZ250 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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