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TMS320C5535AZHH05

Texas Instruments

TMS320C5535AZHH05 by Texas Instruments

TMS320C5535AZHH05 by Texas Instruments is a 16-bit DSP with 163840 RAM words, operating at max 12 MHz. Ideal for digital signal processing applications due to its low power mode, multiple internal bus architecture, and 1.15V supply voltage range.

Median Price

$6.520

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 47 parts In-Stock

1+ parts

$6.520

100+ parts

$4.880

1k+ parts

$4.240

10k+ parts

$3.420

47

$6.520

$4.880

$4.240

$3.420

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,374 parts In-Stock

1+ parts

$6.194

100+ parts

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4,374

$6.194

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Vyrian

USA . 3,605 parts In-Stock

1+ parts

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3,605

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ACDS - Activité Composants Distribution Service

France . 82 parts In-Stock

1+ parts

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82

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Bristol Electronics

USA . 82 parts In-Stock

1+ parts

-

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82

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Dan-Mar Components

USA . 82 parts In-Stock

1+ parts

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82

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,203 parts In-Stock

1+ parts

$5.868

100+ parts

-

1k+ parts

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3,203

$5.868

-

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Corohmni

South Africa . 694 parts In-Stock

1+ parts

$37.480

100+ parts

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694

$37.480

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Parana Technologies

USA . 1,082 parts In-Stock

1+ parts

$61.730

100+ parts

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1,082

$61.730

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DigiPath Technology Company

USA . 1,256 parts In-Stock

1+ parts

$67.972

100+ parts

$62.534

1k+ parts

-

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1,256

$67.972

$62.534

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ChromeModa Solutions

Germany . 1,890 parts In-Stock

1+ parts

$69.359

100+ parts

$56.874

1k+ parts

-

10k+ parts

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1,890

$69.359

$56.874

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IDEA Electronic Components Group

UK . 1,799 parts In-Stock

1+ parts

$69.359

100+ parts

$65.891

1k+ parts

$62.423

10k+ parts

-

1,799

$69.359

$65.891

$62.423

-

Component Stockers USA

USA . 670 parts In-Stock

1+ parts

$99.990

100+ parts

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670

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 16,689 parts In-Stock

1+ parts

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16,689

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Microchip USA

USA . 439 parts In-Stock

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439

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Overview

Unleash the power of digital signal processing with the TMS320C5535AZHH05 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers cutting-edge technology that exceeds industry standards. This DSP offers endless possibilities for applications in audio processing, telecommunications, and more. Experience superior performance, reliability, and efficiency with this product, providing you with unbeatable value and unmatched benefits. Upgrade your projects with the TMS320C5535AZHH05 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the DSP, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Maximum Supply Voltage: 1.15 V

The maximum supply voltage of 1.15 V ensures safe operation and prevents potential damage to the DSP.

On Chip Data RAM Width: 8

Having an 8-bit data RAM width enables efficient data processing and storage for the DSP.

Package Shape: SQUARE

Square package shape offers better space utilization and easier integration into PCB layouts.

Bit Size: 16

A 16-bit architecture allows for higher precision and accuracy in signal processing tasks.

Power Supplies (V): 1.05,1.8/3.3

Multiple power supply options provide flexibility in voltage requirements, making the DSP compatible with various systems.

No. of Terminals: 144

Having 144 terminals allows for connectivity to multiple external devices, expanding the functionality of the DSP.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal performance and mechanical stability for the DSP.

Minimum Supply Voltage: 0.998 V

The minimum supply voltage of 0.998 V ensures reliable operation even under lower voltage conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the DSP can withstand elevated temperatures in industrial applications.

No. of External Interrupts: 2

Having 2 external interrupts allows for timely response to external events, enhancing real-time processing capabilities.

Minimum Operating Temperature: -10 °C

With a minimum operating temperature of -10°C, the DSP can operate in cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, optimizing space utilization on the board.

Maximum Seated Height: 1.4 mm

A low seated height of 1.4 mm allows for compact device designs and reduces overall system height.

RAM Words: 163840

With 163840 RAM words, the DSP can efficiently store and manipulate large amounts of data for complex signal processing tasks.

Width: 12 mm

A compact width of 12 mm enables easy integration of the DSP into space-constrained applications.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging during product development and maintenance.

Maximum Clock Frequency: 12 MHz

A maximum clock frequency of 12 MHz enables fast signal processing and real-time response to input signals.

Maximum Time At Peak Reflow Temperature (s): 30

The DSP can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the DSP can undergo high-temperature soldering processes without damage.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data transfer and communication within the DSP, enhancing overall performance.

Length: 12 mm

A length of 12 mm offers a compact form factor for the DSP, enabling easy integration into various electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard temperature environments, making the DSP suitable for general-purpose applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor, the DSP is optimized for processing digital signals efficiently, making it a reliable choice for signal processing applications.

No. of Timers: 4

Having 4 timers allows for precise timing control in the DSP, enabling synchronization of operations and tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the energy efficiency and reliability of the DSP.

Terminal Form: BALL

Ball terminal form simplifies soldering and ensures reliable connections for the DSP, enhancing manufacturing and assembly processes.

Nominal Supply Voltage: 1.05 V

A nominal supply voltage of 1.05 V provides stable power supply for the DSP, ensuring consistent performance in various operating conditions.

No. of DMA Channels: 16

Having 16 DMA channels allows for efficient data transfer and processing, reducing the burden on the CPU and enhancing overall system performance.

ROM Programmability: MROM

MROM programmability ensures that the DSP's program memory is non-volatile and retains the stored program even when power is turned off.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for high-density mounting of the DSP on PCBs, saving space and enabling compact device designs.

Format: FIXED POINT

Fixed-point format allows for efficient digital signal processing with reduced computational complexity, making the DSP suitable for real-time applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the DSP is suitable for reflow soldering processes and has a moderate sensitivity to moisture exposure.

Low Power Mode: YES

Low power mode capability allows for energy-efficient operation of the DSP, extending battery life and reducing overall power consumption.

On Chip Program ROM Width: 8

An 8-bit program ROM width enables efficient storage and retrieval of program instructions for the DSP, enhancing program execution speed and efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5535AZHH05 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

144

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA144,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05,1.8/3.3

Qualification:

Not Qualified

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320C5535AZHH05 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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