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TMS320C5535AZAY05

Texas Instruments

TMS320C5535AZAY05 by Texas Instruments

TMS320C5535AZAY05 by Texas Instruments is a 16-bit DSP with 163840 RAM words, operating at max 12 MHz clock frequency. Ideal for digital signal processing applications due to its low power mode, multiple internal bus architecture, and 1.15 V supply voltage.

Median Price

$6.864

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,236 parts In-Stock

1+ parts

$4.957

100+ parts

$4.344

1k+ parts

$2.454

10k+ parts

-

1,236

$4.957

$4.344

$2.454

-

Mouser Electronics

USA . 675 parts In-Stock

1+ parts

$8.770

100+ parts

$4.280

1k+ parts

$4.100

10k+ parts

$3.910

675

$8.770

$4.280

$4.100

$3.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,816 parts In-Stock

1+ parts

$4.709

100+ parts

-

1k+ parts

-

10k+ parts

-

1,816

$4.709

-

-

-

Vyrian

USA . 5,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,668

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,998 parts In-Stock

1+ parts

$4.461

100+ parts

-

1k+ parts

-

10k+ parts

-

4,998

$4.461

-

-

-

Microchip USA

USA . 1,929 parts In-Stock

1+ parts

$31.420

100+ parts

$31.220

1k+ parts

$31.130

10k+ parts

$31.030

1,929

$31.420

$31.220

$31.130

$31.030

Parana Technologies

USA . 380 parts In-Stock

1+ parts

$61.562

100+ parts

$5,716.983

1k+ parts

$55.406

10k+ parts

-

380

$61.562

$5,716.983

$55.406

-

DigiPath Technology Company

USA . 1,627 parts In-Stock

1+ parts

$67.788

100+ parts

-

1k+ parts

-

10k+ parts

-

1,627

$67.788

-

-

-

ChromeModa Solutions

Germany . 5,368 parts In-Stock

1+ parts

$69.171

100+ parts

$56.720

1k+ parts

-

10k+ parts

-

5,368

$69.171

$56.720

-

-

IDEA Electronic Components Group

UK . 17 parts In-Stock

1+ parts

$69.171

100+ parts

$65.712

1k+ parts

$62.254

10k+ parts

-

17

$69.171

$65.712

$62.254

-

Corohmni

South Africa . 26 parts In-Stock

1+ parts

$73.519

100+ parts

-

1k+ parts

-

10k+ parts

-

26

$73.519

-

-

-

Overview

Unlock the power of cutting-edge technology with the TMS320C5535AZAY05 by Texas Instruments. As a leader in the industry, Texas Instruments delivers unparalleled quality and reliability in their products. This digital signal processor (DSP) is perfect for a wide range of applications, offering high performance and efficiency. Experience seamless operation and superior functionality with this versatile device. Trust in Texas Instruments to provide you with the tools you need to succeed in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection.

Surface Mount: YES

Allows for easy and efficient installation on PCBs.

Maximum Supply Voltage: 1.15 V

Operates at a safe voltage level for reliability.

On Chip Data RAM Width: 16

Provides ample space for data processing and storage.

Package Shape: SQUARE

Optimal shape for efficient use of space on PCBs.

Bit Size: 16

Capable of handling complex processing tasks with precision.

No. of Terminals: 144

Sufficient terminals for connectivity and interfacing with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Improves signal integrity and thermal performance.

Minimum Supply Voltage: 0.998 V

Operates efficiently at lower voltage levels for power savings.

Maximum Operating Temperature: 70 °C

Can withstand higher temperatures for extended operational use.

No. of External Interrupts: 2

Allows for efficient handling of external events.

Minimum Operating Temperature: -10 °C

Can function in lower temperature environments.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Facilitates easy PCB layout and design.

Maximum Seated Height: 1.4 mm

Low profile design for compact installations.

RAM Words: 163840

Ample memory for storing and processing data efficiently.

Width: 12 mm

Compact size for space-saving integration.

Boundary Scan: YES

Facilitates testing and debugging during production and maintenance.

Maximum Clock Frequency: 12 MHz

High clock frequency for fast data processing.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for reflow soldering process.

Peak Reflow Temperature °C: 260

Good thermal resistance for soldering processes.

Internal Bus Architecture: MULTIPLE

Efficient internal data transfer capabilities.

Length: 12 mm

Balanced dimensions for compact design.

Temperature Grade: COMMERCIAL

Suitable for standard commercial operating environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated processing capabilities for handling digital signals.

No. of Timers: 4

Multiple timers for event scheduling and coordination.

Technology: CMOS

Low power consumption and high-speed processing.

Terminal Form: BALL

Facilitates easy soldering and connectivity.

Nominal Supply Voltage: 1.05 V

Stable voltage supply for consistent performance.

No. of DMA Channels: 16

Multiple channels for efficient data transfer and processing.

ROM Programmability: MROM

Offers non-volatile memory for program storage.

Terminal Pitch: 0.8 mm

Optimal pitch for compact PCB layouts.

Format: FIXED POINT

Ideal for processing fixed-point arithmetic operations efficiently.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity for standard handling protocols.

Low Power Mode: YES

Provides energy-saving mode for improved efficiency.

On Chip Program ROM Width: 8

Dedicated space for program storage and execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5535AZAY05 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

144

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320C5535AZAY05 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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