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TMS320C5532AZAY05

Texas Instruments

TMS320C5532AZAY05 by Texas Instruments

TMS320C5532AZAY05 by Texas Instruments is a 16-bit DSP with 32768 RAM words, operating at max 12 MHz. Ideal for digital signal processing applications due to its low power mode, multiple internal bus architecture, and 1.15V supply voltage. Suitable for commercial use with a temp range of -10 to 70 °C.

Median Price

$5.183

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 29,380 parts In-Stock

1+ parts

$3.466

100+ parts

$3.037

1k+ parts

$1.716

10k+ parts

-

29,380

$3.466

$3.037

$1.716

-

Mouser Electronics

USA . 320 parts In-Stock

1+ parts

$6.900

100+ parts

$3.890

1k+ parts

$2.860

10k+ parts

$2.780

320

$6.900

$3.890

$2.860

$2.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,329 parts In-Stock

1+ parts

$3.293

100+ parts

-

1k+ parts

-

10k+ parts

-

4,329

$3.293

-

-

-

Vyrian

USA . 4,106 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,106

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,224 parts In-Stock

1+ parts

$3.119

100+ parts

-

1k+ parts

-

10k+ parts

-

4,224

$3.119

-

-

-

Parana Technologies

USA . 1,447 parts In-Stock

1+ parts

$73.389

100+ parts

-

1k+ parts

-

10k+ parts

-

1,447

$73.389

-

-

-

Corohmni

South Africa . 536 parts In-Stock

1+ parts

$78.259

100+ parts

-

1k+ parts

-

10k+ parts

-

536

$78.259

-

-

-

ChromeModa Solutions

Germany . 6,527 parts In-Stock

1+ parts

$82.460

100+ parts

$67.617

1k+ parts

-

10k+ parts

-

6,527

$82.460

$67.617

-

-

IDEA Electronic Components Group

UK . 656 parts In-Stock

1+ parts

$82.460

100+ parts

$78.337

1k+ parts

$74.214

10k+ parts

-

656

$82.460

$78.337

$74.214

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

DigiPath Technology Company

USA . 622 parts In-Stock

1+ parts

-

100+ parts

$74.346

1k+ parts

-

10k+ parts

-

622

-

$74.346

-

-

Overview

Experience the next level of digital signal processing with the TMS320C5532AZAY05 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products trusted by professionals worldwide. This DSP is perfect for applications in audio processing, communications, and industrial control systems. With its low power mode, high clock frequency, and versatile internal bus architecture, this product offers unmatched performance and efficiency. Elevate your projects with the TMS320C5532AZAY05 and experience the difference that quality and innovation can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Surface Mount: YES

Facilitates easy and quick integration onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.15 V

Allows for reliable and stable performance within the specified voltage range.

On Chip Data RAM Width: 16

Enables efficient data processing and storage capabilities for complex signal processing tasks.

Package Shape: SQUARE

A compact design that helps in optimizing space on the PCB while maintaining structural integrity.

Bit Size: 16

Provides adequate precision for handling digital signal processing tasks with accuracy.

No. of Terminals: 144

Offers a high level of connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances the overall performance and reliability of the DSP in various applications.

Minimum Supply Voltage: 0.998 V

Supports low-power operation and energy efficiency in the system.

Maximum Operating Temperature: 70 °C

Ensures stable operation even in high-temperature environments, expanding the range of applications.

No. of External Interrupts: 2

Allows for efficient handling of external events and interrupts, enhancing real-time signal processing capabilities.

Minimum Operating Temperature: -10 °C

Enables operation in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

Ensures good conductivity and corrosion resistance for reliable terminal connections.

Maximum Seated Height: 1.4 mm

Facilitates compact and low-profile designs for space-constrained applications.

RAM Words: 32768

Provides ample memory capacity for storing and processing data efficiently.

Width: 12 mm

Compact size enables flexibility in placement and integration within electronic systems.

Boundary Scan: YES

Simplifies testing, debugging, and monitoring of the DSP during manufacturing and operation.

Maximum Clock Frequency: 12 MHz

Supports high-speed data processing and signal handling for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and mounting of the DSP during assembly processes.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for secure and reliable solder joints.

Internal Bus Architecture: MULTIPLE

Enhances data throughput and communication speed within the DSP for efficient processing.

Length: 12 mm

Combines with the compact width for a small footprint and easy integration into electronic systems.

Temperature Grade: COMMERCIAL

Suitable for standard commercial operating environments, making it versatile for various applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Offers diverse peripheral options for interfacing with different types of devices and components.

No. of Timers: 4

Enables precise timing control and synchronization of processes within the DSP.

Technology: CMOS

Provides low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: BALL

Facilitates reliable and secure connections with the PCB for stable performance.

Nominal Supply Voltage: 1.05 V

Offers a stable voltage reference for consistent and reliable operation of the DSP.

No. of DMA Channels: 16

Enables efficient data transfer and processing with multiple channels for improved performance.

ROM Programmability: MROM

Provides inherent non-volatile memory capabilities for storing program instructions and data.

Terminal Pitch: 0.8 mm

Enables fine-pitch connections for compact and high-density PCB layouts.

Format: FIXED POINT

Suitable for applications requiring fixed-point arithmetic operations with efficient performance.

Moisture Sensitivity Level (MSL): 3

Indicates the level of moisture resistance, ensuring reliability in various operating conditions.

Low Power Mode: YES

Supports energy-efficient operation for extended battery life and reduced power consumption.

On Chip Program ROM Width: 8

Provides additional on-chip memory for program storage and execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5532AZAY05 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

144

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320C5532AZAY05 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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