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TMS320C5515AZCH10

Texas Instruments

TMS320C5515AZCH10 by Texas Instruments

TMS320C5515AZCH10 by Texas Instruments is a 16-bit DSP with 163840 RAM words, 12 MHz clock frequency, and 196 terminals. Ideal for digital signal processing applications, it features a low power mode, boundary scan support, and a max operating temperature of 70°C.

Median Price

$7.799

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,929 parts In-Stock

1+ parts

$7.485

100+ parts

$6.538

1k+ parts

$4.509

10k+ parts

-

2,929

$7.485

$6.538

$4.509

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Mouser Electronics

USA . 41 parts In-Stock

1+ parts

$11.580

100+ parts

$7.550

1k+ parts

$6.950

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-

41

$11.580

$7.550

$6.950

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Rochester

USA . 553 parts In-Stock

1+ parts

-

100+ parts

$6.490

1k+ parts

$5.810

10k+ parts

$5.460

553

-

$6.490

$5.810

$5.460

DigiKey

USA . 553 parts In-Stock

1+ parts

-

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$8.540

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553

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$8.540

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Verical

USA . 423 parts In-Stock

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-

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$8.113

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$7.263

10k+ parts

$6.825

423

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$8.113

$7.263

$6.825

Avnet

USA . 42 parts In-Stock

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-

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$6.872

10k+ parts

$6.748

42

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$6.872

$6.748

Distributors (In-Stock)

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Digiode

USA . 2,281 parts In-Stock

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$5.947

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2,281

$5.947

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Vyrian

USA . 2,823 parts In-Stock

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2,823

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DigiKey Marketplace

USA . 553 parts In-Stock

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553

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Electronics Depot

USA . 18 parts In-Stock

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Cyclops Electronics Ltd

UK . 16 parts In-Stock

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Prism Electronics

USA . 7 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,495 parts In-Stock

1+ parts

$5.634

100+ parts

-

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4,495

$5.634

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Corohmni

South Africa . 2,487 parts In-Stock

1+ parts

$6.705

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2,487

$6.705

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Parana Technologies

USA . 1,129 parts In-Stock

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$34.965

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1,129

$34.965

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ChromeModa Solutions

Germany . 350 parts In-Stock

1+ parts

$39.287

100+ parts

$32.215

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350

$39.287

$32.215

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IDEA Electronic Components Group

UK . 330 parts In-Stock

1+ parts

$39.287

100+ parts

$37.323

1k+ parts

$35.358

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330

$39.287

$37.323

$35.358

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DigiPath Technology Company

USA . 2,074 parts In-Stock

1+ parts

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$35.421

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2,074

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$35.421

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Kepictronics

USA . 865 parts In-Stock

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865

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Perfect Parts

USA . 669 parts In-Stock

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669

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Overview

Unlock the potential of cutting-edge technology with the TMS320C5515AZCH10 by Texas Instruments. As a leading manufacturer in digital signal processors, Texas Instruments delivers top-quality products that set new standards in performance and efficiency. The TMS320C5515AZCH10 is a game-changer in the DSP category, offering customers unparalleled value and benefits. Whether you're working on audio processing, telecommunications, or industrial applications, this product's advanced features and capabilities will take your projects to the next level. Trust Texas Instruments to power your innovations and bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the DSP, making it suitable for various environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.15 V

Provides a stable power source for the DSP to operate efficiently and reliably.

On Chip Data RAM Width: 8

Enables the DSP to process and store data quickly, improving overall performance.

Address Bus Width: 21

Allows the DSP to access a large memory space, enhancing its data processing capabilities.

Package Shape: SQUARE

Facilitates easy integration into circuit designs and reduces wasted space on the PCB.

Bit Size: 16

Provides sufficient computational power for handling complex DSP algorithms and calculations.

Power Supplies (V): 1.05/1.3,1.8/3.3

Offers flexibility in power input options, allowing for compatibility with various systems and components.

No. of Terminals: 196

Provides ample connectivity options for interfacing with other devices and components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances thermal performance, signal integrity, and overall reliability of the DSP package.

Minimum Supply Voltage: 0.998 V

Ensures that the DSP can operate within a safe voltage range, preventing damage or malfunctions.

Maximum Operating Temperature: 70 °C

Allows the DSP to operate in high-temperature environments without compromising performance or reliability.

No. of External Interrupts: 2

Enables the DSP to respond to external events or signals promptly, improving real-time processing capabilities.

Minimum Operating Temperature: -10 °C

Ensures that the DSP can function reliably in low-temperature conditions without issues.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and durable finish for the terminals, ensuring long-term connectivity and performance.

Terminal Position: BOTTOM

Facilitates easy and secure installation of the DSP onto the PCB, improving assembly efficiency.

Maximum Seated Height: 1.3 mm

Allows for a compact and low-profile design, saving space in the overall system layout.

RAM Words: 163840

Provides ample memory capacity for storing and processing data efficiently, enhancing overall performance.

Width: 10 mm

Offers a compact form factor for easy integration into various electronic devices and systems.

Boundary Scan: YES

Facilitates testing and debugging of the DSP during production and maintenance, ensuring overall system reliability.

External Data Bus Width: 16

Allows for high-speed data transfer between the DSP and external components, improving overall system performance.

Maximum Clock Frequency: 12 MHz

Provides sufficient processing speed for handling real-time signal processing tasks efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly of the DSP onto the PCB, preventing damage or reliability issues.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes, ensuring secure and reliable connections.

Internal Bus Architecture: SINGLE

Simplifies the design and operation of the DSP, improving efficiency and reducing complexity.

Length: 10 mm

Helps maintain a compact form factor for the DSP, saving space in the overall system design.

Temperature Grade: COMMERCIAL

Suitable for standard commercial operating environments, offering reliable performance in typical conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Provides versatile connectivity and interfacing options for various applications and system configurations.

No. of Timers: 3

Enables the DSP to perform time-critical tasks and events, enhancing its real-time processing capabilities.

Technology: CMOS

Offers low power consumption and high noise immunity, improving overall reliability and efficiency.

Terminal Form: BALL

Facilitates reliable and secure connections with the PCB and other components, ensuring long-term performance.

Nominal Supply Voltage: 1.05 V

Provides a stable and optimal voltage level for the DSP to operate at its best performance.

No. of DMA Channels: 16

Enables efficient data transfer and processing, improving overall system performance and responsiveness.

ROM Programmability: MROM

Offers non-volatile memory for storing essential programs and data, ensuring data retention even after power cycles.

Terminal Pitch: 0.65 mm

Allows for high-density mounting of the DSP onto the PCB, saving space and improving overall system integration.

Format: FIXED POINT

Provides precise and reliable calculations for signal processing tasks, ensuring accuracy in data processing.

Moisture Sensitivity Level (MSL): 3

Ensures that the DSP can withstand different levels of moisture exposure, improving long-term reliability.

Low Power Mode: YES

Enables power-saving operation when not in full use, improving energy efficiency and extending battery life.

On Chip Program ROM Width: 8

Provides sufficient space for storing essential programs and firmware, enhancing overall system functionality.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5515AZCH10 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

21

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

196

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05/1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320C5515AZCH10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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