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TMS320C5504AZCHA12

Texas Instruments

TMS320C5504AZCHA12 by Texas Instruments

TMS320C5504AZCHA12 by Texas Instruments is a 16-bit DSP with 131072 RAM words, operating at max 12 MHz. Ideal for industrial applications, it features low power mode, 196 terminals, and boundary scan capability. With a temperature range of -40 to 85 °C, this DSP offers fixed-point format and MROM programmability.

Median Price

$7.554

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,905 parts In-Stock

1+ parts

$7.258

100+ parts

$6.339

1k+ parts

$4.372

10k+ parts

-

2,905

$7.258

$6.339

$4.372

-

Rochester

USA . 627 parts In-Stock

1+ parts

-

100+ parts

$6.280

1k+ parts

$5.620

10k+ parts

$5.290

627

-

$6.280

$5.620

$5.290

DigiKey

USA . 627 parts In-Stock

1+ parts

-

100+ parts

$8.260

1k+ parts

-

10k+ parts

-

627

-

$8.260

-

-

Verical

USA . 622 parts In-Stock

1+ parts

-

100+ parts

$7.850

1k+ parts

$7.025

10k+ parts

$6.612

622

-

$7.850

$7.025

$6.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,906 parts In-Stock

1+ parts

$5.766

100+ parts

-

1k+ parts

-

10k+ parts

-

3,906

$5.766

-

-

-

Vyrian

USA . 4,921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,921

-

-

-

-

DigiKey Marketplace

USA . 627 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

627

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,358 parts In-Stock

1+ parts

$5.463

100+ parts

-

1k+ parts

-

10k+ parts

-

4,358

$5.463

-

-

-

Parana Technologies

USA . 59 parts In-Stock

1+ parts

$19.873

100+ parts

-

1k+ parts

$19.827

10k+ parts

-

59

$19.873

-

$19.827

-

DigiPath Technology Company

USA . 755 parts In-Stock

1+ parts

$21.882

100+ parts

$20.132

1k+ parts

-

10k+ parts

-

755

$21.882

$20.132

-

-

IDEA Electronic Components Group

UK . 298 parts In-Stock

1+ parts

$22.329

100+ parts

$21.213

1k+ parts

$20.096

10k+ parts

-

298

$22.329

$21.213

$20.096

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ChromeModa Solutions

Germany . 145 parts In-Stock

1+ parts

$22.329

100+ parts

$18.310

1k+ parts

-

10k+ parts

-

145

$22.329

$18.310

-

-

Corohmni

South Africa . 687 parts In-Stock

1+ parts

$86.166

100+ parts

-

1k+ parts

-

10k+ parts

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687

$86.166

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-

-

Overview

Experience the power of cutting-edge technology with the TMS320C5504AZCHA12 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. This DSP is perfect for a variety of applications, offering unmatched performance and versatility. With a wide range of power supplies, external interrupts, and timers, this product provides exceptional value and benefits to customers looking for high-quality solutions. Elevate your projects with the TMS320C5504AZCHA12 and experience the difference that Texas Instruments can make in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product easy to handle and resistant to damage.

Maximum Supply Voltage: 1.15 V

Provides stable power to the DSP, ensuring optimal performance without the risk of overloading.

RAM Words: 131072

Large RAM capacity allows for efficient data processing and storage, enabling complex signal processing tasks.

Maximum Clock Frequency: 12 MHz

High clock frequency allows for fast data processing and execution of tasks, improving overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed specifically for digital signal processing tasks, ensuring optimized performance in signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5504AZCHA12 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

21

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

196

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05/1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

131072

ROM Programmability:

MROM

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320C5504AZCHA12 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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