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TMS320C5502ZAVR300

Texas Instruments

TMS320C5502ZAVR300 by Texas Instruments

TMS320C5502ZAVR300 by Texas Instruments is a 16-bit DSP with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 20 MHz, making it ideal for industrial applications requiring high-speed signal processing in a compact package. With low power mode and multiple timers, this DSP offers efficient performance for various digital signal processing tasks.

Median Price

$12.926

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,000 parts In-Stock

1+ parts

$12.926

100+ parts

$11.291

1k+ parts

$7.787

10k+ parts

-

3,000

$12.926

$11.291

$7.787

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,051 parts In-Stock

1+ parts

$12.280

100+ parts

-

1k+ parts

-

10k+ parts

-

2,051

$12.280

-

-

-

Vyrian

USA . 5,528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,528

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,214 parts In-Stock

1+ parts

$9.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1,214

$9.280

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-

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Corphita

USA . 3,195 parts In-Stock

1+ parts

$11.633

100+ parts

-

1k+ parts

-

10k+ parts

-

3,195

$11.633

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-

-

Parana Technologies

USA . 1,828 parts In-Stock

1+ parts

$24.720

100+ parts

-

1k+ parts

$25.392

10k+ parts

-

1,828

$24.720

-

$25.392

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ChromeModa Solutions

Germany . 2,113 parts In-Stock

1+ parts

$27.775

100+ parts

$22.776

1k+ parts

-

10k+ parts

-

2,113

$27.775

$22.776

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-

IDEA Electronic Components Group

UK . 433 parts In-Stock

1+ parts

$27.775

100+ parts

$26.386

1k+ parts

$24.998

10k+ parts

-

433

$27.775

$26.386

$24.998

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Corohmni

South Africa . 1,085 parts In-Stock

1+ parts

$28.821

100+ parts

-

1k+ parts

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1,085

$28.821

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QUARKTWIN TECHNOLOGY LTD

USA . 19,848 parts In-Stock

1+ parts

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19,848

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DigiPath Technology Company

USA . 646 parts In-Stock

1+ parts

-

100+ parts

$25.042

1k+ parts

-

10k+ parts

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646

-

$25.042

-

-

Overview

Experience unparalleled performance and efficiency with Texas Instruments' TMS320C5502ZAVR300 Digital Signal Processor. Designed for a wide range of applications, this DSP offers integrated cache, low power mode, and multiple timers to meet your processing needs. With a maximum clock frequency of 20 MHz and industrial-grade temperature tolerance, this product ensures reliable performance in any environment. Trust in Texas Instruments' reputation for quality and innovation to deliver cutting-edge technology that exceeds expectations. Unlock new possibilities and enhance your projects with the TMS320C5502ZAVR300.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and lightweight design, making the product suitable for various applications.

Integrated Cache: YES

The integrated cache helps in improving processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage allows for efficient power management and optimal performance.

On Chip Data RAM Width: 16

The wider data RAM width enhances data processing capabilities and speed.

Address Bus Width: 20

The wider address bus width allows for handling larger memory addresses and data transfer.

Package Shape: SQUARE

The square package shape simplifies the product's integration into circuit designs.

Bit Size: 16

The 16-bit size enables processing of data in smaller chunks, improving efficiency.

No. of Terminals: 201

With a higher number of terminals, the product can connect to various components for enhanced functionality.

Minimum Supply Voltage: 1.2 V

The lower minimum supply voltage ensures energy efficiency and reduced power consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the product suitable for industrial environments.

No. of External Interrupts: 4

The multiple external interrupt capabilities allow for efficient handling of external events and tasks.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures the product's functionality in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and ensures reliable connections for improved performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier mounting and installation of the DSP.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for compact design and space-saving integration.

RAM Words: 32768

The large RAM capacity enables storage of a significant amount of data for processing.

Width: 15 mm

The compact width facilitates flexible placement within circuit layouts.

Boundary Scan: YES

The boundary scan feature helps in testing and debugging the DSP during production and troubleshooting.

External Data Bus Width: 32

The wider external data bus width allows for faster data transfer and processing between components.

Maximum Clock Frequency: 20 MHz

The high clock frequency enables speedy execution of operations and real-time processing.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required at peak reflow temperature aids in quick and efficient manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and component connection reliability.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data communication and transfer speed within the DSP.

Length: 15 mm

The moderate length enables easy integration and compatibility with standard circuit board sizes.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product's reliability and performance in harsh operating conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type enhances the DSP's connectivity and compatibility with various devices and peripherals.

No. of Timers: 4

The multiple timers enable precise timing functions and scheduling tasks efficiently.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with various systems.

Terminal Form: BALL

The ball terminal form facilitates reliable connections and soldering during installation.

Maximum Supply Current: 239 mA

The moderate supply current ensures efficient power usage and longer battery life.

Nominal Supply Voltage: 1.26 V

The nominal supply voltage provides stable power input for consistent performance.

No. of DMA Channels: 6

The multiple DMA channels allow for efficient data transfer and processing with minimal CPU intervention.

ROM Programmability: MROM

The MROM programmability ensures secure and permanent storage of essential firmware and instructions.

Terminal Pitch: 0.8 mm

The small terminal pitch enables compact design and tighter component integration on the PCB.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances computational efficiency.

Moisture Sensitivity Level (MSL): 3

The MSL level indicates the product's resistance to moisture and environmental conditions.

Low Power Mode: YES

The low power mode option allows for energy-saving operation and extended battery life.

On Chip Program ROM Width: 16

The 16-bit width of the on-chip program ROM enhances program storage and execution speed.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5502ZAVR300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B201

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

201

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA201,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320C5502ZAVR300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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