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TMS320C52PZA57

Texas Instruments

TMS320C52PZA57 by Texas Instruments

TMS320C52PZA57 by Texas Instruments is a 16-bit DSP with 1056 RAM words, clocked at 57.14 MHz. Ideal for industrial applications, it features low power mode and barrel shifter for efficient processing in digital signal processing tasks. With a package style of flatpack and boundary scan support, this CMOS technology-based processor offers high performance in a compact form factor.

Median Price

$10.650

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 56 parts In-Stock

1+ parts

-

100+ parts

$8.520

1k+ parts

$7.620

10k+ parts

$7.180

56

-

$8.520

$7.620

$7.180

DigiKey

USA . 56 parts In-Stock

1+ parts

-

100+ parts

$11.210

1k+ parts

-

10k+ parts

-

56

-

$11.210

-

-

Verical

USA . 56 parts In-Stock

1+ parts

-

100+ parts

$10.650

1k+ parts

$9.525

10k+ parts

$8.975

56

-

$10.650

$9.525

$8.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,786 parts In-Stock

1+ parts

$8.996

100+ parts

-

1k+ parts

-

10k+ parts

-

1,786

$8.996

-

-

-

Vyrian

USA . 3,014 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,014

-

-

-

-

DigiKey Marketplace

USA . 56 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

56

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,554 parts In-Stock

1+ parts

$8.523

100+ parts

-

1k+ parts

-

10k+ parts

-

3,554

$8.523

-

-

-

Parana Technologies

USA . 1,427 parts In-Stock

1+ parts

$17.026

100+ parts

-

1k+ parts

$17.250

10k+ parts

-

1,427

$17.026

-

$17.250

-

DigiPath Technology Company

USA . 860 parts In-Stock

1+ parts

$18.747

100+ parts

$17.248

1k+ parts

-

10k+ parts

-

860

$18.747

$17.248

-

-

IDEA Electronic Components Group

UK . 1,237 parts In-Stock

1+ parts

$19.130

100+ parts

$18.174

1k+ parts

$17.217

10k+ parts

-

1,237

$19.130

$18.174

$17.217

-

ChromeModa Solutions

Germany . 223 parts In-Stock

1+ parts

$19.130

100+ parts

$15.687

1k+ parts

-

10k+ parts

-

223

$19.130

$15.687

-

-

Microchip USA

USA . 2,084 parts In-Stock

1+ parts

$25.450

100+ parts

$25.090

1k+ parts

$24.910

10k+ parts

$24.720

2,084

$25.450

$25.090

$24.910

$24.720

Corohmni

South Africa . 2,384 parts In-Stock

1+ parts

$34.307

100+ parts

-

1k+ parts

-

10k+ parts

-

2,384

$34.307

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 11,909 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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11,909

-

-

-

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Kepictronics

USA . 56 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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56

-

-

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Overview

Enhance your digital signal processing projects with the TMS320C52PZA57 by Texas Instruments. This high-quality DSP offers unparalleled value and benefits, thanks to its advanced technology and reliable performance. With a maximum clock frequency of 57.14 MHz and a robust internal bus architecture, this product is perfect for a wide range of applications in the industrial field. Trust Texas Instruments to deliver top-notch products that exceed expectations. Upgrade your systems with the TMS320C52PZA57 today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP, ensuring reliable performance over time.

Maximum Supply Voltage: 5.25 V

Allows for a higher input voltage range, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape is easy to handle and allows for efficient use of space on a circuit board.

Maximum Clock Frequency: 57.14 MHz

High clock frequency enables fast processing speeds and efficient execution of signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C52PZA57 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

57.14 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1056

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

112 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320C52PZA57 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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