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TMS320C51PQ100

Texas Instruments

TMS320C51PQ100 by Texas Instruments

TMS320C51PQ100 by Texas Instruments is a 16-bit DSP with 2080 RAM words, operating at up to 100 MHz. Ideal for digital signal processing applications, it features a max supply voltage of 5.25 V and operates in commercial temperature grades from 0 to 70°C.

Median Price

$22.175

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 765 parts In-Stock

1+ parts

-

100+ parts

$17.740

1k+ parts

$15.870

10k+ parts

$14.940

765

-

$17.740

$15.870

$14.940

DigiKey

USA . 765 parts In-Stock

1+ parts

-

100+ parts

$23.340

1k+ parts

-

10k+ parts

-

765

-

$23.340

-

-

Verical

USA . 765 parts In-Stock

1+ parts

-

100+ parts

$22.175

1k+ parts

$19.837

10k+ parts

$18.675

765

-

$22.175

$19.837

$18.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,473 parts In-Stock

1+ parts

$18.724

100+ parts

-

1k+ parts

-

10k+ parts

-

2,473

$18.724

-

-

-

Vyrian

USA . 4,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,647

-

-

-

-

DigiKey Marketplace

USA . 765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

765

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 40 parts In-Stock

1+ parts

$17.570

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$17.570

-

-

-

Corphita

USA . 3,121 parts In-Stock

1+ parts

$17.739

100+ parts

-

1k+ parts

-

10k+ parts

-

3,121

$17.739

-

-

-

Parana Technologies

USA . 1,750 parts In-Stock

1+ parts

$44.751

100+ parts

-

1k+ parts

-

10k+ parts

-

1,750

$44.751

-

-

-

DigiPath Technology Company

USA . 1,958 parts In-Stock

1+ parts

$49.276

100+ parts

$45.334

1k+ parts

-

10k+ parts

-

1,958

$49.276

$45.334

-

-

ChromeModa Solutions

Germany . 6,753 parts In-Stock

1+ parts

$50.282

100+ parts

$41.231

1k+ parts

-

10k+ parts

-

6,753

$50.282

$41.231

-

-

IDEA Electronic Components Group

UK . 1,029 parts In-Stock

1+ parts

$50.282

100+ parts

$47.768

1k+ parts

$45.254

10k+ parts

-

1,029

$50.282

$47.768

$45.254

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,509

-

-

-

-

Kepictronics

USA . 765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

765

-

-

-

-

Overview

Unleash the power of cutting-edge digital signal processing with the TMS320C51PQ100 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers top-quality products that push the boundaries of innovation. This DSP is perfect for a wide range of applications, offering unmatched performance and reliability. Experience seamless operation, efficient power management, and superior functionality with the TMS320C51PQ100. Elevate your projects to new heights with this game-changing solution from Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance provides flexibility in power supply options and robustness in varying operating conditions.

Address Bus Width: 16

With a wide address bus width of 16, the product can access a large memory space efficiently, enabling complex signal processing tasks.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures automotive-grade quality, making the product suitable for use in automotive electronics applications where reliability is critical.

Bit Size: 16

A 16-bit architecture allows for high precision processing, suitable for applications requiring accurate signal analysis and manipulation.

Power Supplies (V): 5

The standard power supply voltage of 5V simplifies power management and compatibility with existing circuitry.

No. of Terminals: 132

Having 132 terminals provides ample connection points for interfacing with external components, expanding the product's functionality and versatility.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact form factor, making it suitable for space-constrained applications while still providing sufficient room for internal components.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage requirement ensures efficient power consumption and operation even in low power scenarios.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the product can withstand elevated temperatures, making it suitable for industrial and harsh environments.

Minimum Operating Temperature: 0 °C

The product can operate at temperatures as low as 0°C, enabling it to function reliably in cold environments.

Terminal Position: QUAD

The quad terminal position allows for easy alignment and soldering onto the circuit board, facilitating the assembly process.

Maximum Seated Height: 4.57 mm

The low maximum seated height enables a slim profile, making it suitable for applications where space constraints are a concern.

RAM Words: 2080

With 2080 RAM words, the product has ample memory capacity to store and process data efficiently, allowing for complex signal processing algorithms.

Width: 24.13 mm

The compact width of 24.13 mm enables easy integration into tight spaces, ideal for applications where size is a limiting factor.

Boundary Scan: YES

Having boundary scan capability facilitates testing and debugging during production, ensuring quality and reliability in the final product.

External Data Bus Width: 16

A wide external data bus width of 16 enables high-speed data transfer between the processor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 100 MHz

The high maximum clock frequency of 100 MHz allows for fast data processing and real-time operation, suitable for time-sensitive applications.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow and communication within the processor, improving overall efficiency and performance.

Length: 24.13 mm

The compact length of 24.13 mm complements the width, making the product suitable for applications where space optimization is crucial.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions, making it suitable for general-purpose applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The presence of peripheral ICs enhances the product's capabilities for interfacing with external devices, expanding its functionality and versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating environments.

Terminal Form: GULL WING

The gull wing terminal form facilitates reliable soldering onto the circuit board, ensuring secure connections for stable operation.

Maximum Supply Current: 185 mA

The moderate maximum supply current requirement of 185 mA ensures efficient power consumption and compatibility with standard power sources.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides a stable power source for consistent performance, reducing the risk of voltage fluctuations.

Terminal Pitch: 0.635 mm

The fine terminal pitch of 0.635 mm allows for high-density packaging and efficient use of PCB space, ideal for compact designs.

Format: FIXED POINT

Utilizing a fixed-point format simplifies arithmetic operations and enhances computational efficiency, making the product suitable for real-time signal processing tasks.

Low Power Mode: YES

The low power mode feature allows for reduced power consumption during idle or low activity periods, increasing energy efficiency and extending battery life.

Barrel Shifter: YES

Including a barrel shifter enhances the product's ability to perform complex bitwise operations and data manipulations, improving processing speed and efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C51PQ100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

1K WORDS DATA/PROG RAM

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Low Power Mode:

YES

No. of Terminals:

132

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2080

Screening Level:

AEC-Q100

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

185 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

TMS320C51PQ100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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