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TMDS461PZT

Texas Instruments

TMDS461PZT by Texas Instruments

TMDS461PZT by Texas Instruments is a 3.3V consumer IC with 100 terminals in a square package. It operates b/w 0-70°C, suitable for commercial applications. With a thin profile and fine pitch, it's ideal for surface mount assembly in various electronic devices.

Median Price

$2.210

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,600 parts In-Stock

1+ parts

$2.210

100+ parts

$2.170

1k+ parts

$2.120

10k+ parts

-

3,600

$2.210

$2.170

$2.120

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,746 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,746

-

-

-

-

Digiode

USA . 4,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,796

-

-

-

-

Chip Stock

USA . 612 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

612

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 695 parts In-Stock

1+ parts

$2.765

100+ parts

-

1k+ parts

$3.250

10k+ parts

-

695

$2.765

-

$3.250

-

DigiPath Technology Company

USA . 2,021 parts In-Stock

1+ parts

$3.045

100+ parts

$2.801

1k+ parts

-

10k+ parts

-

2,021

$3.045

$2.801

-

-

ChromeModa Solutions

Germany . 1,020 parts In-Stock

1+ parts

$3.107

100+ parts

$2.548

1k+ parts

-

10k+ parts

-

1,020

$3.107

$2.548

-

-

IDEA Electronic Components Group

UK . 125 parts In-Stock

1+ parts

$3.107

100+ parts

-

1k+ parts

$2.796

10k+ parts

-

125

$3.107

-

$2.796

-

One Stop Electronics

USA . 627 parts In-Stock

1+ parts

$7.800

100+ parts

-

1k+ parts

-

10k+ parts

-

627

$7.800

-

-

-

AZTECH Wire

Italy . 705 parts In-Stock

1+ parts

$10.052

100+ parts

-

1k+ parts

-

10k+ parts

-

705

$10.052

-

-

-

Microchip USA

USA . 106 parts In-Stock

1+ parts

$32.440

100+ parts

$32.340

1k+ parts

$32.340

10k+ parts

$32.240

106

$32.440

$32.340

$32.340

$32.240

Corphita

USA . 2,418 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,418

-

-

-

-

Overview

Discover the cutting-edge TMDS461PZT by Texas Instruments, a top-of-the-line consumer IC that boasts unmatched quality and reliability. Designed with precision by a trusted manufacturer, this product is perfect for a wide range of applications. From its sleek package design to its high-performance capabilities, this IC offers unparalleled value and benefits to customers. Upgrade your projects with the TMDS461PZT and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the package lightweight and durable, suitable for consumer electronic devices.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost.

Package Shape: SQUARE

The square shape allows for efficient use of space on the PCB and facilitates a clean and organized layout.

Power Supplies (V): 3.3

Operating at 3.3V makes it compatible with a wide range of electronic devices and power sources.

No. of Terminals: 100

Having a high number of terminals provides flexibility in connecting various components and peripherals to the IC.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the IC can perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures the IC's functionality in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Maximum Seated Height: 1.2 mm

The low seated height is beneficial for slim and compact device designs.

Width: 14 mm

The compact width enables the IC to fit in tight spaces on the PCB.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage ensures efficient power consumption and compatibility with various power sources.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for robust solder joints during the PCB assembly process.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates that the IC is suitable for standard surface mount assembly processes.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V ensures the safety and reliability of the IC under varying voltage conditions.

Technical Specifications

Other Function Consumer ICs TMDS461PZT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

220 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TMDS461PZT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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