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TLV5540CNSLE

Texas Instruments

TLV5540CNSLE by Texas Instruments

TLV5540CNSLE by Texas Instruments is an 8-bit ADC with 40 MHz sample rate. It has a max linearity error of 0.3906% and operates b/w 0-70°C. Ideal for applications requiring high-speed analog-to-digital conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,178 parts In-Stock

1+ parts

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5,178

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Digiode

USA . 1,180 parts In-Stock

1+ parts

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1,180

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 735 parts In-Stock

1+ parts

$14.390

100+ parts

-

1k+ parts

$14.831

10k+ parts

-

735

$14.390

-

$14.831

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ChromeModa Solutions

Germany . 2,905 parts In-Stock

1+ parts

$16.169

100+ parts

$13.259

1k+ parts

-

10k+ parts

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2,905

$16.169

$13.259

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IDEA Electronic Components Group

UK . 1,321 parts In-Stock

1+ parts

$16.169

100+ parts

$15.361

1k+ parts

$14.552

10k+ parts

-

1,321

$16.169

$15.361

$14.552

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AZTECH Wire

Italy . 250 parts In-Stock

1+ parts

$19.225

100+ parts

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250

$19.225

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One Stop Electronics

USA . 931 parts In-Stock

1+ parts

$23.000

100+ parts

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931

$23.000

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Corphita

USA . 4,393 parts In-Stock

1+ parts

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4,393

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DigiPath Technology Company

USA . 483 parts In-Stock

1+ parts

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100+ parts

$14.578

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483

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$14.578

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Overview

Unlock unparalleled precision and reliability with the TLV5540CNSLE by Texas Instruments, a leading name in cutting-edge technology. As a high-quality Analog-to-Digital Converter, this product boasts superior performance and accuracy, making it ideal for a wide range of applications. From industrial automation to medical devices, this converter delivers unmatched value, providing customers with precise data acquisition and seamless integration. Trust Texas Instruments to power your innovations with the TLV5540CNSLE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that protects the internal components of the converter.

No. of Bits: 8

Provides a high resolution for accurate analog-to-digital conversion.

Maximum Linearity Error (EL): 0.3906%

Ensures precise conversion without significant errors.

Sample Rate: 40 MHz

High sample rate allows for fast and accurate conversion of analog signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Nominal Supply Voltage: 5 V

Common supply voltage for easy integration into various electronic systems.

Technical Specifications

Analog-to-Digital Converters TLV5540CNSLE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.3906 %

Sample Rate:

40 MHz

Hold Mode:

Sample

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.591 in (15 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G24

Qualified:

No

Trade Compliance

TLV5540CNSLE Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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