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TLV5535IPWRQ1

Texas Instruments

TLV5535IPWRQ1 by Texas Instruments

TLV5535IPWRQ1 by Texas Instruments is an 8-bit ADC with 0.9375% linearity error, 35 MHz sample rate, and 3.3 V supply voltage. Ideal for industrial applications requiring fast conversion times and high accuracy in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,698 parts In-Stock

1+ parts

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6,698

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Digiode

USA . 557 parts In-Stock

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557

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 347 parts In-Stock

1+ parts

$16.612

100+ parts

-

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347

$16.612

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Parana Technologies

USA . 543 parts In-Stock

1+ parts

$19.592

100+ parts

-

1k+ parts

$19.588

10k+ parts

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543

$19.592

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$19.588

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ChromeModa Solutions

Germany . 4,717 parts In-Stock

1+ parts

$22.014

100+ parts

$18.051

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4,717

$22.014

$18.051

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IDEA Electronic Components Group

UK . 2,222 parts In-Stock

1+ parts

$22.014

100+ parts

$20.913

1k+ parts

$19.813

10k+ parts

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2,222

$22.014

$20.913

$19.813

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One Stop Electronics

USA . 1,571 parts In-Stock

1+ parts

$31.000

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1,571

$31.000

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Corphita

USA . 4,444 parts In-Stock

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4,444

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DigiPath Technology Company

USA . 422 parts In-Stock

1+ parts

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$19.848

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422

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$19.848

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Microchip USA

USA . 370 parts In-Stock

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370

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Overview

Experience unparalleled precision and reliability with the TLV5535IPWRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Analog-to-Digital Converters that excel in a variety of applications. With a focus on quality and innovation, this product offers customers the value and benefits they need for their projects. Whether you're designing automotive systems, industrial equipment, or consumer electronics, trust in the TLV5535IPWRQ1 to deliver exceptional performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the ADC.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Screening Level: AEC-Q100

Certified for automotive applications, ensuring reliability and performance under harsh conditions.

No. of Bits: 8

Provides a resolution of 8 bits for accurate digital conversion.

Maximum Linearity Error (EL): 0.9375 %

Ensures accurate conversion of analog signals with minimal error.

Power Supplies (V): 3.3

Operates efficiently at a standard voltage supply of 3.3V.

No. of Terminals: 28

Provides multiple connection points for interfacing with external devices.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Allows for compact and space-saving integration into electronic systems.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications that require operation at high temperatures.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, ideal for a wide range of operating environments.

Terminal Position: DUAL

Provides flexibility in PCB layout and connection options.

Maximum Conversion Time: 0.0285 us

Enables fast and efficient analog-to-digital signal conversion.

Maximum Seated Height: 1.2 mm

Allows for low-profile and compact designs in electronic systems.

Width: 4.4 mm

Compact size enables integration into small electronic devices.

Length: 9.7 mm

Compact dimensions make it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards for temperature and performance.

Maximum Analog Input Voltage: 3.5 V

Allows for a wide range of input voltage signals.

Sample Rate: 35 MHz

Provides high-speed sampling for real-time signal conversion.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Facilitates easy soldering and connection to the PCB.

Converter Type: ADC, PROPRIETARY METHOD

Utilizes a proprietary method for analog-to-digital conversion, ensuring high accuracy and performance.

Nominal Supply Voltage: 3.3 V

Operates efficiently at a standard voltage supply of 3.3V.

Output Bit Code: BINARY

Provides digital output in binary format for compatibility with digital systems.

Terminal Pitch: 0.65 mm

Allows for precise spacing of terminals for easy PCB layout.

Minimum Analog Input Voltage: 0.8 V

Can accurately convert low-level analog signals.

Output Format: PARALLEL, 8 BITS

Delivers digital output in a parallel format with 8 bits for detailed signal representation.

Sample and Hold/Track and Hold: SAMPLE

Uses sample and hold method for accurate analog signal conversion.

Technical Specifications

Analog-to-Digital Converters TLV5535IPWRQ1 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.9375 %

Sample Rate:

35 MHz

Hold Mode:

Sample

Maximum Conversion Time:

28.5 ns

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

800 mV

Maximum Analog Input Voltage:

3.5 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP28,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

Screening Level:

AEC-Q100

Trade Compliance

TLV5535IPWRQ1 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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