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TLV5510INSLE

Texas Instruments

TLV5510INSLE by Texas Instruments

TLV5510INSLE by Texas Instruments is an 8-bit A/D converter with 0.39% linearity error, operating at 3V. It has a max analog input voltage of 2.7V and temp range from -20 to 70°C. Ideal for applications requiring precise analog-to-digital conversion in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,099 parts In-Stock

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4,099

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Digiode

USA . 3,339 parts In-Stock

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3,339

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 589 parts In-Stock

1+ parts

$7.617

100+ parts

-

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589

$7.617

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Parana Technologies

USA . 2,002 parts In-Stock

1+ parts

$12.833

100+ parts

-

1k+ parts

$13.304

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2,002

$12.833

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$13.304

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DigiPath Technology Company

USA . 1,143 parts In-Stock

1+ parts

$14.131

100+ parts

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1,143

$14.131

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ChromeModa Solutions

Germany . 4,307 parts In-Stock

1+ parts

$14.419

100+ parts

$11.824

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4,307

$14.419

$11.824

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IDEA Electronic Components Group

UK . 736 parts In-Stock

1+ parts

$14.419

100+ parts

$13.698

1k+ parts

$12.977

10k+ parts

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736

$14.419

$13.698

$12.977

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One Stop Electronics

USA . 491 parts In-Stock

1+ parts

$19.000

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491

$19.000

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Corphita

USA . 3,427 parts In-Stock

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3,427

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Overview

Enhance your electronic designs with the TLV5510INSLE from Texas Instruments, a leading manufacturer known for top-quality analog-to-digital converters. Perfect for a wide range of applications, this product offers exceptional value with its high performance and reliability. With precise accuracy and efficient power consumption, the TLV5510INSLE delivers optimal results while maximizing functionality. Upgrade your projects with this innovative solution and experience the benefits that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and minimizing errors during production.

No. of Bits: 8

The 8-bit resolution provides a good balance between accuracy and cost, making it suitable for a wide range of applications.

Maximum Linearity Error (EL): 0.39 %

The low linearity error ensures accurate conversion of analog signals to digital, resulting in reliable and precise data acquisition.

No. of Terminals: 24

The high number of terminals allows for versatile connectivity options, enabling the device to interface with multiple components in a system.

Maximum Operating Temperature: 70 °C

The wide operating temperature range ensures the device can withstand harsh environmental conditions, making it suitable for various industrial applications.

Technical Specifications

Analog-to-Digital Converters TLV5510INSLE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Maximum Linearity Error (EL):

0.39 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Operating Conditions

Minimum Operating Temperature:

-20 °C (-4 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP24,.3

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G24

Qualified:

No

Trade Compliance

TLV5510INSLE Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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