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TLV5535IPW

Texas Instruments

TLV5535IPW by Texas Instruments

TLV5535IPW by Texas Instruments is an 8-bit ADC with 0.9375% linearity error, 35 MHz sample rate, and 3.3 V supply voltage. Ideal for industrial applications requiring fast conversion times and low power consumption. Package style: small outline, thin profile, shrink pitch.

Median Price

$7.110

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,043 parts In-Stock

1+ parts

-

100+ parts

$6.320

1k+ parts

$5.650

10k+ parts

$5.320

9,043

-

$6.320

$5.650

$5.320

DigiKey

USA . 9,043 parts In-Stock

1+ parts

-

100+ parts

$8.310

1k+ parts

-

10k+ parts

-

9,043

-

$8.310

-

-

Verical

USA . 5,300 parts In-Stock

1+ parts

-

100+ parts

$7.900

1k+ parts

$7.063

10k+ parts

$6.650

5,300

-

$7.900

$7.063

$6.650

Chip1Stop

Japan . 1,500 parts In-Stock

1+ parts

-

100+ parts

$4.550

1k+ parts

-

10k+ parts

-

1,500

-

$4.550

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 570 parts In-Stock

1+ parts

$4.550

100+ parts

-

1k+ parts

-

10k+ parts

-

570

$4.550

-

-

-

Digiode

USA . 4,508 parts In-Stock

1+ parts

$5.795

100+ parts

-

1k+ parts

-

10k+ parts

-

4,508

$5.795

-

-

-

DigiKey Marketplace

USA . 9,043 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,043

-

-

-

-

Bristol Electronics

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,114 parts In-Stock

1+ parts

$5.490

100+ parts

-

1k+ parts

-

10k+ parts

-

2,114

$5.490

-

-

-

Parana Technologies

USA . 30 parts In-Stock

1+ parts

$13.473

100+ parts

-

1k+ parts

$13.986

10k+ parts

-

30

$13.473

-

$13.986

-

ChromeModa Solutions

Germany . 4,542 parts In-Stock

1+ parts

$15.138

100+ parts

$12.413

1k+ parts

-

10k+ parts

-

4,542

$15.138

$12.413

-

-

IDEA Electronic Components Group

UK . 1,930 parts In-Stock

1+ parts

$15.138

100+ parts

$14.381

1k+ parts

$13.624

10k+ parts

-

1,930

$15.138

$14.381

$13.624

-

Microchip USA

USA . 2,543 parts In-Stock

1+ parts

$15.260

100+ parts

$15.040

1k+ parts

$14.930

10k+ parts

$14.820

2,543

$15.260

$15.040

$14.930

$14.820

Lixinc

USA . 15,387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,387

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,498

-

-

-

-

Kepictronics

USA . 69 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

69

-

-

-

-

DigiPath Technology Company

USA . 23 parts In-Stock

1+ parts

-

100+ parts

$13.648

1k+ parts

-

10k+ parts

-

23

-

$13.648

-

-

Overview

Unlock the power of precision with the TLV5535IPW Analog-to-Digital Converter by Texas Instruments. Designed for industrial-grade applications, this high-quality converter offers unparalleled accuracy and efficiency. With a sample rate of 35 MHz and a maximum linearity error of only 0.9375%, this product ensures reliable and precise data conversion every time. Whether you're in need of fast and accurate signal processing or reliable data acquisition, the TLV5535IPW is the perfect solution for your needs. Trust Texas Instruments for top-of-the-line technology that delivers exceptional performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly.

No. of Bits: 8

Provides an 8-bit resolution for accurate analog-to-digital conversion.

Power Supplies (V): 3.3

Operates on a common 3.3V power supply, making it compatible with many systems.

Maximum Operating Temperature: 85 °C

Can function in a wide range of temperatures, suitable for various environments.

Sample Rate: 35 MHz

High sample rate allows for fast conversion speeds, ideal for high-speed applications.

Technical Specifications

Analog-to-Digital Converters TLV5535IPW attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.9375 %

Sample Rate:

35 MHz

Hold Mode:

Sample

Maximum Conversion Time:

28 ns

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-1.6 V

Maximum Analog Input Voltage:

1.6 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Current:

34 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP28,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV5535IPW Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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