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TLV5535IPWRG4

Texas Instruments

TLV5535IPWRG4 by Texas Instruments

TLV5535IPWRG4 by Texas Instruments is an 8-bit ADC with 35 MHz sample rate, 0.9375% linearity error, and 3.3V supply voltage. Ideal for industrial applications requiring high-speed analog-to-digital conversion in a compact SOT-28 package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,492 parts In-Stock

1+ parts

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3,492

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Vyrian

USA . 2,675 parts In-Stock

1+ parts

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100+ parts

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2,675

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,306 parts In-Stock

1+ parts

$18.305

100+ parts

-

1k+ parts

$18.437

10k+ parts

-

1,306

$18.305

-

$18.437

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AZTECH Wire

Italy . 390 parts In-Stock

1+ parts

$19.579

100+ parts

-

1k+ parts

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10k+ parts

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390

$19.579

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DigiPath Technology Company

USA . 1,133 parts In-Stock

1+ parts

$20.156

100+ parts

$18.543

1k+ parts

-

10k+ parts

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1,133

$20.156

$18.543

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ChromeModa Solutions

Germany . 4,918 parts In-Stock

1+ parts

$20.567

100+ parts

$16.865

1k+ parts

-

10k+ parts

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4,918

$20.567

$16.865

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IDEA Electronic Components Group

UK . 1,217 parts In-Stock

1+ parts

$20.567

100+ parts

$19.539

1k+ parts

$18.510

10k+ parts

-

1,217

$20.567

$19.539

$18.510

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One Stop Electronics

USA . 1,348 parts In-Stock

1+ parts

$23.000

100+ parts

-

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1,348

$23.000

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Kepictronics

USA . 3,250 parts In-Stock

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3,250

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Corphita

USA . 1,324 parts In-Stock

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1,324

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Overview

Discover the Texas Instruments TLV5535IPWRG4, a high-quality Analog-to-Digital Converter that offers unparalleled precision and reliability. With Texas Instruments' reputation for excellence in manufacturing, this converter is ideal for a wide range of applications. From industrial automation to consumer electronics, the TLV5535IPWRG4 delivers exceptional value, providing customers with accurate and efficient data conversion. Experience the advantages of Texas Instruments technology with this innovative product, setting new standards in performance and quality. Elevate your projects with the TLV5535IPWRG4 and unlock endless possibilities in digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and stability for the internal components of the converter.

Surface Mount: YES

Allows for easy and convenient PCB assembly and integration.

No. of Bits: 8

Offers sufficient resolution for accurate digital conversion of analog signals.

Maximum Linearity Error (EL): 0.9375%

Ensures high accuracy and precision in the conversion process.

Power Supplies (V): 3.3

Compatible with standard power sources, making it easy to integrate into existing systems.

No. of Terminals: 28

Provides multiple connection points for versatile applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables compact and space-saving designs for electronic devices.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Technology: CMOS

Offers low power consumption and high noise immunity for efficient operation.

Output Format: PARALLEL, 8 BITS

Delivers digital output in a standard format for easy processing by other components.

Technical Specifications

Analog-to-Digital Converters TLV5535IPWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.9375 %

Sample Rate:

35 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

800 mV

Maximum Analog Input Voltage:

3.5 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP28,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV5535IPWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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