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TLV5580CDWG4

Texas Instruments

TLV5580CDWG4 by Texas Instruments

TLV5580CDWG4 by Texas Instruments is an 8-bit ADC with 0.9375% linearity error, 80 MHz sample rate, and 3.3 V supply voltage. Ideal for commercial applications, it offers a parallel output format in a small outline package suitable for surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,645 parts In-Stock

1+ parts

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6,645

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Digiode

USA . 690 parts In-Stock

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690

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 868 parts In-Stock

1+ parts

$5.356

100+ parts

-

1k+ parts

$6.026

10k+ parts

-

868

$5.356

-

$6.026

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DigiPath Technology Company

USA . 1,295 parts In-Stock

1+ parts

$5.898

100+ parts

-

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1,295

$5.898

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ChromeModa Solutions

Germany . 4,829 parts In-Stock

1+ parts

$6.018

100+ parts

$4.935

1k+ parts

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4,829

$6.018

$4.935

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IDEA Electronic Components Group

UK . 742 parts In-Stock

1+ parts

$6.018

100+ parts

-

1k+ parts

$5.416

10k+ parts

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742

$6.018

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$5.416

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AZTECH Wire

Italy . 266 parts In-Stock

1+ parts

$17.624

100+ parts

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266

$17.624

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One Stop Electronics

USA . 951 parts In-Stock

1+ parts

$25.000

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951

$25.000

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Corphita

USA . 1,838 parts In-Stock

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1,838

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Kepictronics

USA . 200 parts In-Stock

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200

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Overview

Unleash the power of precision with the TLV5580CDWG4 by Texas Instruments, a top-quality Analog-to-Digital Converter that promises unparalleled performance and reliability. This innovative product opens up a world of possibilities in various applications, delivering seamless conversion with minimal error. With Texas Instruments' renowned expertise in semiconductor technology, customers can trust in the exceptional value and benefits that this converter brings. Elevate your projects to new heights with the TLV5580CDWG4 and experience unmatched quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for the package ensures the product is easy to handle and long-lasting.

Surface Mount: YES

Easy installation and space-saving design make this product convenient for various applications.

No. of Bits: 8

Offers a good resolution for converting analog signals to digital data accurately.

Maximum Linearity Error (EL): 0.9375%

High linearity error ensures precise conversion and reliable performance.

Power Supplies (V): 3.3

Compatible with standard power supplies, making it easy to integrate into existing systems.

No. of Terminals: 28

Sufficient terminals for connectivity and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Compact package size for easy integration in compact devices or densely populated PCBs.

Maximum Operating Temperature: 70 °C

Wide operating temperature range for reliability in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance.

Sample Rate: 80 MHz

High sample rate for capturing fast-changing analog signals accurately.

Technical Specifications

Analog-to-Digital Converters TLV5580CDWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.9375 %

Sample Rate:

80 MHz

Hold Mode:

Sample

Maximum Conversion Time:

12.5 ns

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

800 mV

Maximum Analog Input Voltage:

3.5 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP28,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV5580CDWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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