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TL16C554APNG4

Texas Instruments

TL16C554APNG4 by Texas Instruments

TL16C554APNG4 by Texas Instruments is a Serial Communication Controller with 3.6V max supply voltage, 16MHz clock frequency, and 0.125 MBps data transfer rate. Ideal for applications requiring high-speed asynchronous communication in commercial-grade environments.

Median Price

$32.590

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 86 parts In-Stock

1+ parts

$32.590

100+ parts

$27.080

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$18.560

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86

$32.590

$27.080

$18.560

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Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

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$9.050

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Digiode

USA . 773 parts In-Stock

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$21.822

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Vyrian

USA . 7,992 parts In-Stock

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ComSIT Distribution GmbH

Germany . 68 parts In-Stock

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ComSIT USA

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LIBRA Elektronik GmbH

Germany . 33 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Resion

USA . 3 parts In-Stock

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PC Components Company LLC

USA . 2 parts In-Stock

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Bristol Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 501 parts In-Stock

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$7.319

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501

$7.319

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Aranea Global

USA . 50 parts In-Stock

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$8.869

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$8.514

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50

$8.869

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$8.514

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Corphita

USA . 906 parts In-Stock

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$20.673

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$20.673

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Parana Technologies

USA . 1,396 parts In-Stock

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$29.214

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$56.908

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$29.214

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$56.908

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ChromeModa Solutions

Germany . 4,720 parts In-Stock

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$32.825

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$26.916

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$32.825

$26.916

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IDEA Electronic Components Group

UK . 1,944 parts In-Stock

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$32.825

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$31.184

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$29.542

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$32.825

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$29.542

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Ampacity Inc.

Singapore . 116 parts In-Stock

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$42.490

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Microchip USA

USA . 1,631 parts In-Stock

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DigiPath Technology Company

USA . 1,384 parts In-Stock

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$29.595

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Perfect Parts

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Assy Fe

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Overview

Unlock seamless and efficient communication with the TL16C554APNG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability. This serial communication controller is versatile, making it ideal for a wide range of applications. Experience high-speed data transfer, precise encoding/decoding methods, and easy integration with its compact design. Maximize productivity and streamline operations with this innovative solution that offers exceptional value and performance. Elevate your projects with the TL16C554APNG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 3.6 V

Operating within a maximum supply voltage of 3.6 V ensures the product is compatible with a wide range of power sources.

Address Bus Width: 3

Having an address bus width of 3 allows for efficient addressing and communication within the system.

Package Shape: SQUARE

The square package shape helps in saving space and allows for easy integration into compact electronic devices.

Power Supplies (V): 3.3/5

Supporting power supplies of 3.3V and 5V allows for flexibility in powering the product in various applications.

No. of Terminals: 80

Having 80 terminals provides ample connectivity options for interfacing the product with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style of flatpack, low profile, and fine pitch offers easy installation and space-saving benefits for compact electronic designs.

Minimum Supply Voltage: 3 V

Operating within a minimum supply voltage of 3V ensures reliable performance even under low power conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can function effectively in a wide range of environmental conditions.

Maximum Data Transfer Rate: 0.125 MBps

The high data transfer rate of 0.125 MBps enables fast and efficient communication between devices.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the product can operate reliably even in colder environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for secure connections and efficient signal transmission within the system.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm helps in reducing the overall profile of the product and enables space-efficient designs.

Width: 12 mm

With a width of 12mm, the product can be easily integrated into compact electronic devices without occupying too much space.

Data Encoding or Decoding Method: NRZ

Using NRZ data encoding/decoding method ensures accurate and reliable transmission of data between devices.

External Data Bus Width: 8

Having an external data bus width of 8 allows for efficient data transfer and processing within the system.

Communication Protocol: ASYNC, BIT

Supporting communication protocols such as Async and Bit enhances compatibility with a wide range of devices and systems.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz enables fast and synchronous data communication within the system.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product can withstand reflow soldering processes without damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliability of connections during manufacturing processes.

Length: 12 mm

With a length of 12mm, the product is compact and can be easily integrated into small electronic devices.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, the product is suitable for a wide range of commercial electronic applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Being a serial IO/communication controller makes the product ideal for facilitating communication between devices in a serial fashion.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly processes.

Maximum Supply Current: 50 mA

Operating within a maximum supply current of 50 mA ensures efficient power consumption and prevents overloading of the product.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent power supply for proper operation of the product.

No. of Serial I/Os: 4

Having 4 serial I/Os provides multiple communication channels for interfacing with other devices and expanding connectivity options.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm allows for compact layout designs and efficient connections on circuit boards.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can withstand typical manufacturing and storage conditions without degradation.

Technical Specifications

Serial Communication Controllers TL16C554APNG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5 V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

4

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TL16C554APNG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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