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TL16C451FN

Texas Instruments

TL16C451FN by Texas Instruments

TL16C451FN by Texas Instruments is a Serial Communication Controller with 5V supply, 0-70°C temp range, and 0.03125 MBps data rate. Ideal for IBM PC-AT bus compatibility, it features 8 I/O lines and operates on a MOS technology platform.

Median Price

$9.714

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 158 parts In-Stock

1+ parts

$9.390

100+ parts

$8.486

1k+ parts

$6.118

10k+ parts

$5.328

158

$9.390

$8.486

$6.118

$5.328

Mouser Electronics

USA . 67 parts In-Stock

1+ parts

$16.460

100+ parts

$11.980

1k+ parts

$9.260

10k+ parts

-

67

$16.460

$11.980

$9.260

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Rochester

USA . 11,603 parts In-Stock

1+ parts

-

100+ parts

$8.030

1k+ parts

$7.180

10k+ parts

$6.760

11,603

-

$8.030

$7.180

$6.760

Verical

USA . 3,330 parts In-Stock

1+ parts

-

100+ parts

$10.037

1k+ parts

$8.975

10k+ parts

$8.450

3,330

-

$10.037

$8.975

$8.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 343 parts In-Stock

1+ parts

$4.470

100+ parts

$4.694

1k+ parts

$4.426

10k+ parts

-

343

$4.470

$4.694

$4.426

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Digiode

USA . 3,447 parts In-Stock

1+ parts

$6.128

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-

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-

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3,447

$6.128

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Bristol Electronics

USA . 98 parts In-Stock

1+ parts

$8.775

100+ parts

$5.265

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-

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98

$8.775

$5.265

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Vyrian

USA . 2,467 parts In-Stock

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-

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2,467

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 534 parts In-Stock

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534

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Lakeland Logistics Inc

USA . 98 parts In-Stock

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98

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Resion

USA . 92 parts In-Stock

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MISTER SPROCKETS

USA . 90 parts In-Stock

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90

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Q Components

USA . 83 parts In-Stock

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83

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First Choice Components Inc.

USA . 76 parts In-Stock

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76

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Lantek

USA . 63 parts In-Stock

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A&K Electronics

USA . 26 parts In-Stock

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Rotakorn

Sweden . 26 parts In-Stock

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LWI Electronics Inc

India . 8 parts In-Stock

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,039 parts In-Stock

1+ parts

$5.805

100+ parts

-

1k+ parts

-

10k+ parts

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2,039

$5.805

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Microchip USA

USA . 2,253 parts In-Stock

1+ parts

$20.140

100+ parts

$19.850

1k+ parts

$19.700

10k+ parts

$19.560

2,253

$20.140

$19.850

$19.700

$19.560

Parana Technologies

USA . 219 parts In-Stock

1+ parts

$59.002

100+ parts

-

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219

$59.002

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ChromeModa Solutions

Germany . 4,821 parts In-Stock

1+ parts

$66.294

100+ parts

$54.361

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4,821

$66.294

$54.361

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IDEA Electronic Components Group

UK . 1,898 parts In-Stock

1+ parts

$66.294

100+ parts

$62.979

1k+ parts

$59.665

10k+ parts

-

1,898

$66.294

$62.979

$59.665

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A-Z Elektronik GmbH

Germany . 5,079 parts In-Stock

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5,079

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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DigiPath Technology Company

USA . 1,144 parts In-Stock

1+ parts

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$59.771

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1,144

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$59.771

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Kepictronics

USA . 270 parts In-Stock

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270

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GreenTree Electronics

Israel . 63 parts In-Stock

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63

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Cyclops Electronics Ltd (Excess)

UK . 55 parts In-Stock

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55

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Overview

Enhance your communication systems with the TL16C451FN by Texas Instruments, a top-tier manufacturer known for its quality products. As a leading Serial Communication Controller, this chip provides seamless data transfer and efficient performance. With a wide range of applications in various industries, this chip offers unparalleled value and benefits to customers looking for reliable and high-speed communication solutions. Upgrade your systems today with the TL16C451FN and experience the advantage of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a sturdy and durable packaging for the controller.

Maximum Supply Voltage: 5.25 V

Allows for a higher supply voltage tolerance, increasing flexibility in system design.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication and bit transmission for versatile connectivity options.

Maximum Clock Frequency: 5.71 MHz

Enables high-speed data transfer and communication.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Specifically designed for serial input/output communication, ensuring reliable performance.

Technical Specifications

Serial Communication Controllers TL16C451FN attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

CENTRONIX PRINTER INTERFACE

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

IBM PC-AT

Maximum Clock Frequency:

5.71 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.03125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

8

No. of Serial I/Os:

1

No. of Terminals:

68

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C451FN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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