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TISP3125F3P

Texas Instruments

TISP3125F3P by Texas Instruments

TISP3125F3P by Texas Instruments is a silicon surge protector with 2 series-connected elements. It features a non-repetitive peak on-state current of 6A and a max DC off-state voltage of 100V. Ideal for protecting electronic devices from voltage surges, it is UL recognized and has a breakdown voltage of 125V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,925 parts In-Stock

1+ parts

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3,925

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Digiode

USA . 2,640 parts In-Stock

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2,640

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,153 parts In-Stock

1+ parts

$2.112

100+ parts

-

1k+ parts

$2.627

10k+ parts

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1,153

$2.112

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$2.627

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DigiPath Technology Company

USA . 2,367 parts In-Stock

1+ parts

$2.326

100+ parts

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2,367

$2.326

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ChromeModa Solutions

Germany . 4,977 parts In-Stock

1+ parts

$2.373

100+ parts

$1.946

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4,977

$2.373

$1.946

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IDEA Electronic Components Group

UK . 1,584 parts In-Stock

1+ parts

$2.373

100+ parts

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1k+ parts

$2.136

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1,584

$2.373

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$2.136

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Semicontronic

India . 893 parts In-Stock

1+ parts

$13.100

100+ parts

$12.772

1k+ parts

$12.707

10k+ parts

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893

$13.100

$12.772

$12.707

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AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$19.877

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254

$19.877

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One Stop Electronics

USA . 1,582 parts In-Stock

1+ parts

$22.100

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1,582

$22.100

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Corphita

USA . 2,002 parts In-Stock

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2,002

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Corohmni

South Africa . 150 parts In-Stock

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150

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Overview

Upgrade your surge protection with the TISP3125F3P by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality silicon surge protectors that offer reliable and efficient protection for your electronic devices. Whether you're looking to safeguard your home electronics or industrial equipment, this series-connected, center tap device with dual terminal position provides peace of mind with its UL recognized standards and maximum breakdown voltage of 125V. Trust Texas Instruments to keep your valuable devices safe from power surges.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the surge protector.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

This configuration enhances the protection capabilities of the surge protector by spreading the load across multiple elements, increasing overall performance.

Non Repetitive Peak On-state Current: 6 A

With a high peak on-state current, this surge protector can effectively handle surge currents, providing reliable protection for connected devices.

Package Shape: RECTANGULAR

The rectangular shape allows for easy installation and space-saving design, making it convenient for various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure connections and easy soldering during installation, ensuring a reliable electrical connection.

Maximum DC Off-state Voltage: 100 V

A high off-state voltage rating ensures that the surge protector can handle a wide range of voltage levels, providing comprehensive protection for connected devices.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

Thyristor surge protectors are known for their fast response time and high surge current handling capabilities, making them ideal for protecting sensitive electronics.

Maximum Breakdown Voltage: 125 V

With a high breakdown voltage, this surge protector can effectively suppress surges and spikes, safeguarding connected devices from electrical damage.

Reference Standard: UL RECOGNIZED

UL recognition ensures that the surge protector meets strict safety and performance standards, providing peace of mind for users.

Technical Specifications

Silicon Surge Protectors TISP3125F3P attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

125 V

Maximum DC Off-state Voltage:

100 V

JESD-30 Code:

R-PDIP-T8

Non Repetitive Peak On-state Current:

6 A

No. of Elements:

2

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP3125F3P Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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