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TISP3125F3D

Texas Instruments

TISP3125F3D by Texas Instruments

TISP3125F3D by Texas Instruments is a Silicon Surge Protector with 4A Non Repetitive Peak On-state Current, 100V Max DC Off-state Voltage, and 125V Max Breakdown Voltage. It is used for surge protection in various electronic applications due to its UL Recognized reference standard and series connected configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,967 parts In-Stock

1+ parts

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7,967

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Digiode

USA . 119 parts In-Stock

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119

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,094 parts In-Stock

1+ parts

$3.100

100+ parts

$3.022

1k+ parts

$3.007

10k+ parts

-

1,094

$3.100

$3.022

$3.007

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Parana Technologies

USA . 983 parts In-Stock

1+ parts

$3.195

100+ parts

-

1k+ parts

$3.718

10k+ parts

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983

$3.195

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$3.718

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DigiPath Technology Company

USA . 1,319 parts In-Stock

1+ parts

$3.518

100+ parts

$3.237

1k+ parts

-

10k+ parts

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1,319

$3.518

$3.237

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ChromeModa Solutions

Germany . 6,101 parts In-Stock

1+ parts

$3.590

100+ parts

$2.944

1k+ parts

-

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6,101

$3.590

$2.944

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IDEA Electronic Components Group

UK . 1,171 parts In-Stock

1+ parts

$3.590

100+ parts

-

1k+ parts

$3.231

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1,171

$3.590

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$3.231

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Ampacity Inc.

Singapore . 1,640 parts In-Stock

1+ parts

$12.100

100+ parts

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1,640

$12.100

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AZTECH Wire

Italy . 705 parts In-Stock

1+ parts

$17.993

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705

$17.993

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One Stop Electronics

USA . 602 parts In-Stock

1+ parts

$22.100

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602

$22.100

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Corohmni

South Africa . 493 parts In-Stock

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493

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Kepictronics

USA . 390 parts In-Stock

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390

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Corphita

USA . 171 parts In-Stock

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171

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Overview

Protect your electronic devices with the reliable TISP3125F3D Silicon Surge Protector by Texas Instruments. With a reputation for manufacturing high-quality components, Texas Instruments delivers peace of mind with this series connected, center tap surge protector. Ideal for a wide range of applications, this product offers customers value through its superior protection against voltage spikes and surges. Say goodbye to worries about electrical damage and trust in the proven reliability of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and reliable protection against surges while keeping the overall product lightweight and cost-effective.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

This configuration allows for efficient and precise surge protection, ensuring the safety of connected devices.

Non Repetitive Peak On-state Current: 4 A

Can handle high current surges, providing effective protection for devices connected to it.

Surface Mount: YES

Easily mountable on circuit boards, making installation and integration into electronic systems convenient.

Package Shape: RECTANGULAR

Space-saving design that fits well in compact electronic devices.

Terminal Form: GULL WING

Facilitates easy soldering onto circuit boards for a secure and stable connection.

Maximum DC Off-state Voltage: 100 V

Capable of handling high voltage spikes and ensuring that connected devices are protected.

Trigger Device Type: SILICON SURGE PROTECTOR

Utilizes silicon technology for reliable surge protection and quick response to surges.

Maximum Breakdown Voltage: 125 V

Provides a safety margin above normal operating voltage levels, ensuring robust protection against surges.

Reference Standard: UL RECOGNIZED

Compliance with UL standards ensures that the surge protector meets safety and performance requirements.

Technical Specifications

Silicon Surge Protectors TISP3125F3D attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

125 V

Maximum DC Off-state Voltage:

100 V

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4 A

No. of Elements:

2

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP3125F3D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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