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TISP7320F3DR

Texas Instruments

TISP7320F3DR by Texas Instruments

TISP7320F3DR by Texas Instruments is a silicon surge protector with 3 delta-connected elements. It has a non-repetitive peak on-state current of 4.3A and max breakdown voltage of 320V. Ideal for protecting electronic devices from surges in applications requiring UL recognized surge protection.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Legend Electronics Inc.

USA . 17,185 parts In-Stock

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17,185

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Chip Stock

USA . 9,060 parts In-Stock

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9,060

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Vyrian

USA . 3,291 parts In-Stock

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3,291

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Digiode

USA . 380 parts In-Stock

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380

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Distributors (Availability)

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Parana Technologies

USA . 1,810 parts In-Stock

1+ parts

$3.453

100+ parts

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$3.977

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1,810

$3.453

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$3.977

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ChromeModa Solutions

Germany . 5,644 parts In-Stock

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$3.880

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$3.182

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5,644

$3.880

$3.182

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IDEA Electronic Components Group

UK . 69 parts In-Stock

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$3.880

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$3.492

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69

$3.880

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$3.492

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AZTECH Wire

Italy . 394 parts In-Stock

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$16.521

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394

$16.521

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One Stop Electronics

USA . 1,258 parts In-Stock

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$17.100

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$17.100

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,306 parts In-Stock

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2,306

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DigiPath Technology Company

USA . 267 parts In-Stock

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$3.498

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267

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$3.498

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Kepictronics

USA . 39 parts In-Stock

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39

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Overview

Enhance the durability and reliability of your electronic devices with the TISP7320F3DR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and performance. This silicon surge protector is designed for various applications, safeguarding your equipment from unexpected power surges. With its compact design and advanced technology, the TISP7320F3DR provides peace of mind and protection for your valuable electronics. Trust Texas Instruments to deliver superior products that prioritize your convenience and safety.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to heat, making it suitable for surge protection applications.

Configuration: DELTA CONNECTED, 3 ELEMENTS

Delta connected configuration with 3 elements ensures efficient distribution of surge current, enhancing the overall protection capability.

Non Repetitive Peak On-state Current: 4.3 A

High non-repetitive peak on-state current rating indicates the surge protector's ability to handle sudden spikes in current without damage.

Surface Mount: YES

Surface mount capability enables easy and convenient installation in various electronic devices.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient utilization of space and easy integration into circuit layouts.

Terminal Form: GULL WING

Gull wing terminal form provides secure connectivity and facilitates soldering during assembly.

Maximum DC Off-state Voltage: 240 V

High maximum DC off-state voltage rating ensures effective protection against voltage spikes and surges.

Maximum Operating Temperature: 70 °C

Wide maximum operating temperature range makes this surge protector suitable for use in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Maximum Breakdown Voltage: 320 V

High maximum breakdown voltage provides an additional safety margin for protecting sensitive electronic components.

Reference Standard: UL RECOGNIZED

UL Recognized certification indicates compliance with industry standards for safety and performance.

Technical Specifications

Silicon Surge Protectors TISP7320F3DR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

320 V

Maximum DC Off-state Voltage:

240 V

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4.3 A

No. of Elements:

3

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7320F3DR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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