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TISP4240H3BJ

Texas Instruments

TISP4240H3BJ by Texas Instruments

TISP4240H3BJ by Texas Instruments is a single silicon surge protector with 60A peak current, 180V DC voltage, and 150°C max temp. Ideal for protecting circuits from surges in various applications due to its thyristor surge protection design and UL recognition.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,456 parts In-Stock

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3,456

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Digiode

USA . 3,333 parts In-Stock

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3,333

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,022 parts In-Stock

1+ parts

$2.100

100+ parts

$2.048

1k+ parts

$2.037

10k+ parts

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1,022

$2.100

$2.048

$2.037

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Parana Technologies

USA . 1,336 parts In-Stock

1+ parts

$2.883

100+ parts

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$3.375

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1,336

$2.883

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$3.375

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DigiPath Technology Company

USA . 704 parts In-Stock

1+ parts

$3.174

100+ parts

$2.920

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704

$3.174

$2.920

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IDEA Electronic Components Group

UK . 910 parts In-Stock

1+ parts

$3.239

100+ parts

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$2.915

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910

$3.239

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$2.915

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ChromeModa Solutions

Germany . 391 parts In-Stock

1+ parts

$3.239

100+ parts

$2.656

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391

$3.239

$2.656

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Ampacity Inc.

Singapore . 1,400 parts In-Stock

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$6.100

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$6.100

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AZTECH Wire

Italy . 603 parts In-Stock

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$9.532

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$9.532

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One Stop Electronics

USA . 1,426 parts In-Stock

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$10.100

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1,426

$10.100

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Corphita

USA . 3,426 parts In-Stock

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Corohmni

South Africa . 449 parts In-Stock

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Overview

Protect your valuable electronic devices with the TISP4240H3BJ by Texas Instruments, a top-tier manufacturer known for quality and reliability. As a silicon surge protector, this device offers unparalleled protection against power surges and spikes, ensuring the longevity of your equipment. Ideal for a range of applications, this product provides peace of mind and security for your electronics. With its compact design and advanced features, the TISP4240H3BJ is the perfect solution for safeguarding your investments. Trust Texas Instruments to deliver superior performance and durability when it matters most.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers durability and resistance to environmental factors, making this surge protector suitable for long-term use in various conditions.

Configuration: SINGLE

Single configuration simplifies installation and maintenance of the surge protector, ensuring straightforward operation.

Non Repetitive Peak On-state Current: 60 A

High non-repetitive peak on-state current capacity allows the surge protector to effectively handle sudden surges or spikes in electrical current, providing reliable protection for connected devices.

Surface Mount: YES

Surface mount capability enables easy and flexible installation options, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for a compact design that can be easily integrated into different electronic systems without occupying much space.

Terminal Form: C BEND

C bend terminal form facilitates secure and stable connections, ensuring efficient performance and reliability of the surge protector.

No. of Terminals: 2

Having two terminals simplifies the connection process and enhances compatibility with different systems or devices.

Package Style (Meter): SMALL OUTLINE

Small outline package style offers a compact and space-saving design, making it ideal for applications where size constraints are a consideration.

Maximum DC Off-state Voltage: 180 V

High maximum DC off-state voltage rating provides effective protection against transient voltage spikes, ensuring the safety of connected equipment.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows the surge protector to function reliably in various environmental conditions, enhancing its versatility and longevity.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

Thyristor surge protector offers fast response times and high surge handling capabilities, ensuring effective protection against electrical surges and spikes.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature capability enables the surge protector to function optimally in colder environments, enhancing its reliability and performance.

Terminal Position: DUAL

Dual terminal position enhances the ease of installation and ensures secure connections, contributing to the overall efficiency and reliability of the surge protector.

Maximum Holding Current: 600 mA

High maximum holding current rating indicates the surge protector's ability to handle sustained currents without tripping, ensuring continuous protection for connected devices.

Maximum Breakdown Voltage: 240 V

High maximum breakdown voltage rating provides robust protection against voltage surges, safeguarding connected devices from potential damage or malfunction.

Reference Standard: UL RECOGNIZED

UL recognition ensures that the surge protector meets industry standards for safety and performance, giving users confidence in the product's quality and reliability.

Technical Specifications

Silicon Surge Protectors TISP4240H3BJ attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

240 V

Configuration:

Maximum DC Off-state Voltage:

180 V

Maximum Holding Current:

600 mA

JEDEC-95 Code:

DO-214AA

JESD-30 Code:

R-PDSO-C2

Non Repetitive Peak On-state Current:

60 A

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Form:

C BEND

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP4240H3BJ Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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