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TAS5066PAGG4

Texas Instruments

TAS5066PAGG4 by Texas Instruments

TAS5066PAGG4 by Texas Instruments is a 64-terminal consumer IC with a package style of flatpack, thin profile, and fine pitch. It operates b/w 0-70°C, with a supply voltage range of 3-3.6V. Ideal for applications requiring compact design and high performance in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,969

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-

-

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Digiode

USA . 332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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332

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,572 parts In-Stock

1+ parts

$3.225

100+ parts

-

1k+ parts

$3.747

10k+ parts

-

1,572

$3.225

-

$3.747

-

ChromeModa Solutions

Germany . 1,219 parts In-Stock

1+ parts

$3.624

100+ parts

$2.972

1k+ parts

-

10k+ parts

-

1,219

$3.624

$2.972

-

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IDEA Electronic Components Group

UK . 708 parts In-Stock

1+ parts

$3.624

100+ parts

-

1k+ parts

$3.262

10k+ parts

-

708

$3.624

-

$3.262

-

One Stop Electronics

USA . 523 parts In-Stock

1+ parts

$4.800

100+ parts

-

1k+ parts

-

10k+ parts

-

523

$4.800

-

-

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AZTECH Wire

Italy . 640 parts In-Stock

1+ parts

$16.928

100+ parts

-

1k+ parts

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10k+ parts

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640

$16.928

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Corphita

USA . 1,236 parts In-Stock

1+ parts

-

100+ parts

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1,236

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DigiPath Technology Company

USA . 431 parts In-Stock

1+ parts

-

100+ parts

$3.267

1k+ parts

-

10k+ parts

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431

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$3.267

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Microchip USA

USA . 406 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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406

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Overview

Elevate your consumer electronics with the TAS5066PAGG4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers exceptional performance and reliability. This versatile IC is perfect for a wide range of applications in consumer circuits, offering customers value and benefits like never before. With its innovative design and superior functionality, the TAS5066PAGG4 is sure to exceed your expectations. Upgrade your devices today with this top-of-the-line solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material can provide a good balance of cost-effectiveness and durability, making this product a reliable choice for various applications.

Surface Mount: YES

Being surface mount compatible allows for easier and more efficient assembly processes, making this product suitable for automated manufacturing.

No. of Terminals: 64

The high number of terminals provides ample connectivity options and versatility for designing complex circuits and applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions and ensure reliable performance in a wide range of situations.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement allows for efficient power usage and compatibility with a variety of power sources, making this product suitable for energy-efficient applications.

Technical Specifications

Other Function Consumer ICs TAS5066PAGG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TAS5066PAGG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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