Loading...

SNJ55563AFJ

Texas Instruments

SNJ55563AFJ by Texas Instruments

SNJ55563AFJ by Texas Instruments is a BICMOS technology graphics display driver with 44 terminals in a square chip carrier package. It operates b/w 0°C to 70°C, with power supplies of 12V and 225V. Ideal for commercial applications requiring high-quality graphics display drivers.

Median Price

$83.760

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$83.760

1k+ parts

$74.940

10k+ parts

$70.540

3

-

$83.760

$74.940

$70.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,127 parts In-Stock

1+ parts

$88.416

100+ parts

-

1k+ parts

-

10k+ parts

-

3,127

$88.416

-

-

-

Vyrian

USA . 6,843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,843

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 653 parts In-Stock

1+ parts

$5.479

100+ parts

-

1k+ parts

$6.210

10k+ parts

-

653

$5.479

-

$6.210

-

ChromeModa Solutions

Germany . 4,068 parts In-Stock

1+ parts

$6.156

100+ parts

$5.048

1k+ parts

-

10k+ parts

-

4,068

$6.156

$5.048

-

-

IDEA Electronic Components Group

UK . 259 parts In-Stock

1+ parts

$6.156

100+ parts

-

1k+ parts

$5.540

10k+ parts

-

259

$6.156

-

$5.540

-

Corphita

USA . 4,152 parts In-Stock

1+ parts

$83.763

100+ parts

-

1k+ parts

-

10k+ parts

-

4,152

$83.763

-

-

-

Component Stockers USA

USA . 2 parts In-Stock

1+ parts

$96.010

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$96.010

-

-

-

Microchip USA

USA . 1,177 parts In-Stock

1+ parts

$143.840

100+ parts

$141.340

1k+ parts

$140.090

10k+ parts

$138.830

1,177

$143.840

$141.340

$140.090

$138.830

DigiPath Technology Company

USA . 727 parts In-Stock

1+ parts

-

100+ parts

$5.550

1k+ parts

-

10k+ parts

-

727

-

$5.550

-

-

Overview

Discover the unparalleled quality and reliability of the SNJ55563AFJ by Texas Instruments, a leading manufacturer in the industry. This graphics display driver offers unmatched performance and precision, making it ideal for a wide range of applications. From enhancing visual displays to improving overall user experience, this product delivers exceptional value and benefits to customers. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations and leads the way in innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and electrical insulation, making them suitable for high-performance applications.

Surface Mount: YES

Surface mount technology allows for efficient assembly processes and compact design, saving space and enhancing reliability.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure reliability and performance under demanding operating conditions, making the product suitable for critical applications.

Package Shape: SQUARE

Square packages offer a good balance between space efficiency and ease of handling during assembly.

Power Supplies (V): 12, 225

Supporting a wide range of power supplies allows for flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 44

Having a higher number of terminals enables the product to interface with multiple components and peripherals, enhancing connectivity and functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer high-density integration, efficient heat dissipation, and easy handling during manufacturing and assembly processes.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand elevated temperatures and operate reliably in various environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures performance even in cold conditions, making the product suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal layout helps in efficient routing of signals, reduces signal interference, and allows for enhanced signal integrity and performance.

Temperature Grade: COMMERCIAL

Commercial-grade components are cost-effective and suitable for standard applications that do not require extreme temperature or performance specifications.

Technology: BICMOS

BICMOS technology offers a combination of the advantages of both Bipolar and CMOS technologies, providing high-speed performance with low power consumption.

Terminal Form: J BEND

J Bend terminals simplify the soldering process during assembly, improve mechanical strength, and offer good electrical contact reliability.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27 mm enables easy mating with compatible connectors and ensures compatibility with industry-standard PCB layouts.

Technical Specifications

Graphics Display Drivers SNJ55563AFJ attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-J44

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

12, 225

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Display Drivers

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNJ55563AFJ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19