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SNJ55500EFD

Texas Instruments

SNJ55500EFD by Texas Instruments

SNJ55500EFD by Texas Instruments is a Graphics Display Driver with 32 segments, operating temperature range of -55 to 125 °C, and max supply voltage of 13.2 V. It is ideal for AC Plasma Displays due to its BICMOS technology and MILITARY grade temperature rating.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,205 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,205

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-

-

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Digiode

USA . 3,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,640

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 684 parts In-Stock

1+ parts

$9.480

100+ parts

-

1k+ parts

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684

$9.480

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-

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Parana Technologies

USA . 196 parts In-Stock

1+ parts

$12.925

100+ parts

-

1k+ parts

$13.412

10k+ parts

-

196

$12.925

-

$13.412

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DigiPath Technology Company

USA . 82 parts In-Stock

1+ parts

$14.233

100+ parts

$13.094

1k+ parts

-

10k+ parts

-

82

$14.233

$13.094

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ChromeModa Solutions

Germany . 4,869 parts In-Stock

1+ parts

$14.523

100+ parts

$11.909

1k+ parts

-

10k+ parts

-

4,869

$14.523

$11.909

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IDEA Electronic Components Group

UK . 1,331 parts In-Stock

1+ parts

$14.523

100+ parts

$13.797

1k+ parts

$13.071

10k+ parts

-

1,331

$14.523

$13.797

$13.071

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One Stop Electronics

USA . 517 parts In-Stock

1+ parts

$34.500

100+ parts

-

1k+ parts

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10k+ parts

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517

$34.500

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Corphita

USA . 4,075 parts In-Stock

1+ parts

-

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4,075

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Overview

Upgrade your display drivers with the Texas Instruments SNJ55500EFD! Designed with quality ceramic and metal-sealed cofired materials, this DOT MATRIX driver offers reliable performance in a compact chip carrier package. Perfect for AC plasma displays, this military-grade BICMOS technology ensures high efficiency and accuracy in data input and output. With a wide voltage range and multiplexed display capability, the SNJ55500EFD delivers unparalleled value and benefits to customers looking for top-notch graphics display drivers. Elevate your display experience today with Texas Instruments!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and protection for the internal components, ensuring long-lasting performance.

Display Mode: DOT MATRIX

Allows for high-resolution and versatile display options.

Data Input Mode: SERIAL

Enables easy and efficient data input for smoother operation.

Surface Mount: YES

Facilitates easy and secure installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 13.2 V

Allows for stable and reliable power supply within the specified range.

Package Shape: SQUARE

Helps in efficient packaging and integration into electronic devices.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high-temperature environments.

Technology: BICMOS

Combines the benefits of both Bipolar and CMOS technologies for improved efficiency and performance.

Technical Specifications

Graphics Display Drivers SNJ55500EFD attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Display Mode:

DOT MATRIX

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

S-CQCC-N44

Multiplexed Display Capability:

YES

No. of Functions:

1

No. of Segments:

32

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

TOTEM-POLE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

13.2 V

Minimum Supply Voltage:

10.8 V

Nominal Supply Voltage:

12 V

Maximum Supply Voltage-1:

100 V

Minimum Supply Voltage-1:

0 V

Nominal Supply Voltage-1:

60 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Minimum fmax:

8 MHz

Trade Compliance

SNJ55500EFD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-334-8678, 5962013348678

NIIN

013348678

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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