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SNJ55500DFD

Texas Instruments

SNJ55500DFD by Texas Instruments

SNJ55500DFD by Texas Instruments is a Graphics Display Driver with 44 terminals in a ceramic chip carrier package. It operates b/w -55°C to 125°C, suitable for military-grade applications. This surface-mount driver is designed for high-reliability environments requiring robust performance.

Median Price

$11.538

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 1 parts In-Stock

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$11.538

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1

$11.538

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Vyrian

USA . 8,589 parts In-Stock

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8,589

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Digiode

USA . 4,734 parts In-Stock

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4,734

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Odi Ramu Company

Canada . 3 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,527 parts In-Stock

1+ parts

$5.846

100+ parts

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$6.627

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1,527

$5.846

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$6.627

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ChromeModa Solutions

Germany . 3,437 parts In-Stock

1+ parts

$6.568

100+ parts

$5.386

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3,437

$6.568

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IDEA Electronic Components Group

UK . 1,742 parts In-Stock

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$6.568

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$5.911

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1,742

$6.568

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$5.911

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AZTECH Wire

Italy . 884 parts In-Stock

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$16.696

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884

$16.696

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One Stop Electronics

USA . 1,297 parts In-Stock

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$29.500

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Corphita

USA . 4,194 parts In-Stock

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4,194

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DigiPath Technology Company

USA . 1,792 parts In-Stock

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$5.922

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1,792

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$5.922

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Overview

Elevate your graphics display experience with the SNJ55500DFD by Texas Instruments. Crafted with precision and quality in mind, this chip carrier package driver offers unparalleled performance and reliability. Whether you're designing medical equipment, aerospace technology, or automotive displays, this military-grade component ensures optimal functionality in extreme conditions. Trust in Texas Instruments to deliver cutting-edge solutions that exceed your expectations. Choose the SNJ55500DFD for superior results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent electrical insulation and thermal conductivity, making it ideal for high temperature applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient mounting on circuit boards, saving space and simplifying assembly processes.

Screening Level: 38535Q/M;38534H;883B

Compliance with multiple screening levels ensures high reliability and quality standards for the product.

Package Shape: SQUARE

Square package shape facilitates uniform heat dissipation and efficient utilization of board space.

No. of Terminals: 44

Higher number of terminals allows for increased connectivity options and functionality in the circuit design.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers enhanced protection for the integrated circuits and minimizes signal interference.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for use in a wide range of temperature conditions, making the product versatile.

Terminal Position: QUAD

Quad terminal position enables efficient signal routing and reduces signal distortion for improved performance.

Temperature Grade: MILITARY

Military grade temperature rating indicates ruggedness and reliability, suitable for extreme conditions and mission-critical applications.

Terminal Form: NO LEAD

Lead-free terminal form promotes environmental sustainability and complies with RoHS regulations.

Terminal Pitch: 1.27 mm

Optimal terminal pitch allows for precise and secure connections, enhancing overall product reliability and performance.

Technical Specifications

Graphics Display Drivers SNJ55500DFD attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N44

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC44,.65SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Display Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNJ55500DFD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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