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SNJ55553FJ

Texas Instruments

SNJ55553FJ by Texas Instruments

SNJ55553FJ by Texas Instruments is a Graphics Display Driver with 44 terminals, operating temperature range of -55 to 125°C, and power supplies of 12V and 60V. It is used in military-grade applications requiring high reliability and performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,758

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-

-

-

Digiode

USA . 1,792 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,792

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 999 parts In-Stock

1+ parts

$10.755

100+ parts

-

1k+ parts

$11.238

10k+ parts

-

999

$10.755

-

$11.238

-

DigiPath Technology Company

USA . 831 parts In-Stock

1+ parts

$11.842

100+ parts

-

1k+ parts

-

10k+ parts

-

831

$11.842

-

-

-

ChromeModa Solutions

Germany . 6,732 parts In-Stock

1+ parts

$12.084

100+ parts

$9.909

1k+ parts

-

10k+ parts

-

6,732

$12.084

$9.909

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-

IDEA Electronic Components Group

UK . 2,214 parts In-Stock

1+ parts

$12.084

100+ parts

$11.480

1k+ parts

$10.876

10k+ parts

-

2,214

$12.084

$11.480

$10.876

-

AZTECH Wire

Italy . 732 parts In-Stock

1+ parts

$14.202

100+ parts

-

1k+ parts

-

10k+ parts

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732

$14.202

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-

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One Stop Electronics

USA . 332 parts In-Stock

1+ parts

$37.500

100+ parts

-

1k+ parts

-

10k+ parts

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332

$37.500

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-

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Corphita

USA . 1,753 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,753

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Overview

Unlock unparalleled performance and reliability with the SNJ55553FJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line Graphics Display Drivers that are perfect for a variety of applications. From aerospace to industrial settings, this product offers unmatched value, benefits, and advantages to customers seeking high-quality solutions. Experience superior quality and cutting-edge technology with the SNJ55553FJ today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers high thermal conductivity and excellent heat dissipation, making it a reliable choice for electronic components that require temperature stability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and reducing production costs.

Screening Level: 38535Q/M;38534H;883B

The multiple screening levels ensure high reliability and quality standards for the product, making it suitable for use in demanding applications.

Package Shape: SQUARE

The square package shape provides uniformity and robustness in design, making it easier to integrate into electronic systems.

Power Supplies (V): 12,60

The ability to operate at both 12V and 60V power supplies offers flexibility in application requirements, allowing for compatibility with a wide range of systems.

No. of Terminals: 44

The high number of terminals allows for increased connectivity options and functionality in the product, making it versatile for various applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides compactness and space-saving advantages, ideal for applications where size constraints are a concern.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions, making it suitable for industrial and military applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for operation in extreme cold environments, enhancing the product's versatility.

Terminal Position: QUAD

The quad terminal position enhances connectivity and ease of installation, contributing to efficient and reliable performance.

Temperature Grade: MILITARY

The military-grade temperature rating ensures durability and performance in rugged environments, making it a trusted choice for critical applications.

Terminal Form: J BEND

The J bend terminal form offers secure connections and durability, reducing the risk of disconnections or malfunctions in the product.

Maximum Supply Current: 27 mA

The maximum supply current of 27 mA ensures efficient power consumption and helps in optimizing energy usage in the product.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact design and space-efficient layout on circuit boards, making it suitable for densely populated electronic assemblies.

Technical Specifications

Graphics Display Drivers SNJ55553FJ attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-J44

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12,60

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Display Drivers

Maximum Supply Current:

27 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNJ55553FJ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-314-2038, 5962013142038

NIIN

013142038

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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