Loading...

SNJ55501EFD

Texas Instruments

SNJ55501EFD by Texas Instruments

SNJ55501EFD by Texas Instruments is a MOS technology graphics display driver with 44 terminals in a square chip carrier package. It operates b/w -55°C to 125°C, suitable for military-grade applications. With a max supply current of 6 mA, it is ideal for surface-mount designs requiring high-temperature performance.

Median Price

$11.538

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 2 parts In-Stock

1+ parts

$11.538

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$11.538

-

-

-

Vyrian

USA . 4,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,840

-

-

-

-

Digiode

USA . 3,574 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,574

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,342 parts In-Stock

1+ parts

$4.275

100+ parts

-

1k+ parts

$4.704

10k+ parts

-

2,342

$4.275

-

$4.704

-

DigiPath Technology Company

USA . 1,871 parts In-Stock

1+ parts

$4.707

100+ parts

-

1k+ parts

-

10k+ parts

-

1,871

$4.707

-

-

-

ChromeModa Solutions

Germany . 4,719 parts In-Stock

1+ parts

$4.803

100+ parts

$3.938

1k+ parts

-

10k+ parts

-

4,719

$4.803

$3.938

-

-

IDEA Electronic Components Group

UK . 2,142 parts In-Stock

1+ parts

$4.803

100+ parts

-

1k+ parts

$4.323

10k+ parts

-

2,142

$4.803

-

$4.323

-

AZTECH Wire

Italy . 802 parts In-Stock

1+ parts

$6.224

100+ parts

-

1k+ parts

-

10k+ parts

-

802

$6.224

-

-

-

One Stop Electronics

USA . 956 parts In-Stock

1+ parts

$14.500

100+ parts

-

1k+ parts

-

10k+ parts

-

956

$14.500

-

-

-

Corphita

USA . 3,497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,497

-

-

-

-

Overview

Elevate your graphics display experience with the SNJ55501EFD by Texas Instruments. Crafted with precision and expertise, this high-quality graphics display driver offers unparalleled performance and reliability. Ideal for a variety of applications, this product is designed to exceed expectations and deliver exceptional results. Trust in Texas Instruments to provide you with cutting-edge technology that enhances your projects and simplifies your workflow. Upgrade to the SNJ55501EFD today and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic materials have excellent thermal conductivity and are resistant to high temperatures, making them ideal for use in electronic components that may generate heat during operation.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on the circuit board, which can help in designing compact and efficient electronic devices.

Screening Level: 38535Q/M;38534H;883B

Meeting multiple screening levels ensures high reliability and quality of the product, making it suitable for critical applications that require consistent performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising its functionality.

Technology: MOS

MOS technology offers low power consumption and high speed performance, making this product energy-efficient and capable of handling complex graphics processing tasks efficiently.

Maximum Supply Current: 6 mA

The low maximum supply current requirement indicates that this product is power-efficient and helps in reducing overall power consumption in electronic devices.

Technical Specifications

Graphics Display Drivers SNJ55501EFD attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N44

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC44,.65SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Display Drivers

Maximum Supply Current:

6 mA

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNJ55501EFD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-316-5947, 5962013165947

NIIN

013165947

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19