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SNJ55553FD

Texas Instruments

SNJ55553FD by Texas Instruments

SNJ55553FD by Texas Instruments is a Graphics Display Driver with DOT MATRIX display mode and SERIAL data input. It operates at 10.8-13.2 V, suitable for military-grade applications. With BICMOS technology, it features TOTEM-POLE output and supports EL displays with 32 segments.

Median Price

$34.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$34.550

1k+ parts

$30.910

10k+ parts

$29.100

2

-

$34.550

$30.910

$29.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,620 parts In-Stock

1+ parts

$36.470

100+ parts

-

1k+ parts

-

10k+ parts

-

1,620

$36.470

-

-

-

Vyrian

USA . 4,233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,233

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 327 parts In-Stock

1+ parts

$2.101

100+ parts

-

1k+ parts

$2.618

10k+ parts

-

327

$2.101

-

$2.618

-

DigiPath Technology Company

USA . 617 parts In-Stock

1+ parts

$2.314

100+ parts

-

1k+ parts

-

10k+ parts

-

617

$2.314

-

-

-

ChromeModa Solutions

Germany . 6,025 parts In-Stock

1+ parts

$2.361

100+ parts

$1.936

1k+ parts

-

10k+ parts

-

6,025

$2.361

$1.936

-

-

IDEA Electronic Components Group

UK . 2,153 parts In-Stock

1+ parts

$2.361

100+ parts

-

1k+ parts

$2.125

10k+ parts

-

2,153

$2.361

-

$2.125

-

Corphita

USA . 1,107 parts In-Stock

1+ parts

$34.551

100+ parts

-

1k+ parts

-

10k+ parts

-

1,107

$34.551

-

-

-

Microchip USA

USA . 2,747 parts In-Stock

1+ parts

$84.760

100+ parts

$83.280

1k+ parts

$82.540

10k+ parts

$81.810

2,747

$84.760

$83.280

$82.540

$81.810

Overview

Enhance your display experience with the SNJ55553FD by Texas Instruments, a premium graphics display driver designed for cutting-edge applications. Crafted with quality ceramic and metal-sealed co-fired materials, this chip carrier package offers unparalleled reliability and performance. Ideal for dot matrix displays, this interface IC type features a serial data input mode for seamless operation. With a wide range of supply voltages and military-grade temperature tolerance, the SNJ55553FD ensures consistent functionality in any environment. Elevate your projects with this top-of-the-line display driver from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability for the product, making it suitable for tough environments.

Display Mode: DOT MATRIX

The dot matrix display mode offers high resolution and versatility in displaying graphics, making it ideal for a variety of applications.

Maximum Supply Voltage: 13.2 V

The high maximum supply voltage of 13.2 V allows for flexibility in power input, accommodating a range of voltage requirements.

Temperature Grade: MILITARY

The military-grade temperature grade ensures that the product can operate effectively in extreme temperature conditions, making it suitable for demanding military applications.

Technology: BICMOS

The use of BICMOS technology combines the advantages of bipolar and CMOS technologies, providing high-speed performance and low power consumption for efficient operation.

Technical Specifications

Graphics Display Drivers SNJ55553FD attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Display Mode:

DOT MATRIX

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

S-CQCC-N44

Length:

16.51 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

32

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

TOTEM-POLE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC44,.65SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12,60

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

3.05 mm

Sub-Category:

Display Drivers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

13.2 V

Minimum Supply Voltage:

10.8 V

Nominal Supply Voltage:

12 V

Maximum Supply Voltage-1:

60 V

Minimum Supply Voltage-1:

0 V

Nominal Supply Voltage-1:

30 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.51 mm

Minimum fmax:

6.25 MHz

Trade Compliance

SNJ55553FD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-251-0254, 5962012510254

NIIN

012510254

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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