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SNJ54S182FK

Texas Instruments

SNJ54S182FK by Texas Instruments

SNJ54S182FK by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 10.5 ns, suitable for military-grade applications. Operating b/w -55 to 125 °C, it has a supply voltage range of 4.5V to 5.5V and a max power supply current of 99mA, making it ideal for high-performance computing systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 7,793 parts In-Stock

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Resion

USA . 189 parts In-Stock

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Digiode

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Electro Mavin

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Q Components

USA . 29 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 9 parts In-Stock

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Electronic Expediters

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AZTECH Wire

Italy . 806 parts In-Stock

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One Stop Electronics

USA . 579 parts In-Stock

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Andel Nordic

Denmark . 3,587 parts In-Stock

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Parana Technologies

USA . 992 parts In-Stock

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DigiPath Technology Company

USA . 1,765 parts In-Stock

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IDEA Electronic Components Group

UK . 2,256 parts In-Stock

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ChromeModa Solutions

Germany . 2,251 parts In-Stock

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Microchip USA

USA . 4,666 parts In-Stock

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Corphita

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Overview

Experience top-notch performance and reliability with the SNJ54S182FK by Texas Instruments, a leading manufacturer in the industry. This digital arithmetic circuit offers unparalleled value with its precision engineering and cutting-edge technology. Ideal for military-grade applications, this chip carrier package ensures optimal functionality in extreme temperatures, making it a versatile solution for a wide range of projects. Trust Texas Instruments to deliver excellence with the SNJ54S182FK, setting new standards for quality and performance. Elevate your designs with this exceptional product today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides durability and protection, making the product suitable for harsh environments.

Surface Mount: YES

The surface mount capability allows for easy and secure installation onto circuit boards, saving time and effort during assembly.

No. of Bits: 4

Having 4 bits allows for efficient processing and calculation of digital signals.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources in electronics.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand extensive use without overheating.

Technology: TTL

The use of TTL technology ensures reliable and fast digital arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SNJ54S182FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH HIGHER ORDER LOOKAHEAD

Family:

S

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

15 pF

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

99 mA

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54S182FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-251-8926, 5962012518926

NIIN

012518926

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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