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SNJ54LVTH574W

Texas Instruments

SNJ54LVTH574W by Texas Instruments

SNJ54LVTH574W by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.9 ns and operates at a supply voltage of 3.3V. It features a MILITARY-grade temperature range, suitable for high-frequency applications up to 150MHz in military environments. This rectangular flatpack package with dual terminals is ideal for enabling low control in unidirectional data transmission systems.

Median Price

$42.909

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,044 parts In-Stock

1+ parts

$42.909

100+ parts

$38.141

1k+ parts

$28.045

10k+ parts

-

1,044

$42.909

$38.141

$28.045

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 731 parts In-Stock

1+ parts

$40.764

100+ parts

-

1k+ parts

-

10k+ parts

-

731

$40.764

-

-

-

Vyrian

USA . 2,982 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,982

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,218 parts In-Stock

1+ parts

$11.384

100+ parts

-

1k+ parts

$10.929

10k+ parts

$10.929

3,218

$11.384

-

$10.929

$10.929

Parana Technologies

USA . 2,209 parts In-Stock

1+ parts

$15.804

100+ parts

-

1k+ parts

$16.160

10k+ parts

-

2,209

$15.804

-

$16.160

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DigiPath Technology Company

USA . 219 parts In-Stock

1+ parts

$17.402

100+ parts

$16.010

1k+ parts

-

10k+ parts

-

219

$17.402

$16.010

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-

ChromeModa Solutions

Germany . 2,943 parts In-Stock

1+ parts

$17.757

100+ parts

$14.561

1k+ parts

-

10k+ parts

-

2,943

$17.757

$14.561

-

-

IDEA Electronic Components Group

UK . 662 parts In-Stock

1+ parts

$17.757

100+ parts

$16.869

1k+ parts

$15.981

10k+ parts

-

662

$17.757

$16.869

$15.981

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AZTECH Wire

Italy . 448 parts In-Stock

1+ parts

$20.830

100+ parts

-

1k+ parts

-

10k+ parts

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448

$20.830

-

-

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Ampacity Inc.

Singapore . 946 parts In-Stock

1+ parts

$36.470

100+ parts

-

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-

10k+ parts

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946

$36.470

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-

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Semicontronic

India . 888 parts In-Stock

1+ parts

$36.470

100+ parts

$35.558

1k+ parts

$35.376

10k+ parts

-

888

$36.470

$35.558

$35.376

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Corphita

USA . 3,545 parts In-Stock

1+ parts

$38.618

100+ parts

-

1k+ parts

-

10k+ parts

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3,545

$38.618

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Corohmni

South Africa . 294 parts In-Stock

1+ parts

$42.909

100+ parts

-

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294

$42.909

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Microchip USA

USA . 1,991 parts In-Stock

1+ parts

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100+ parts

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1,991

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Overview

Unlock the power of seamless data transmission with the Texas Instruments SNJ54LVTH574W Bus Driver & Transceivers. Crafted with precision and expertise, this top-of-the-line product guarantees unparalleled quality and reliability. Ideal for a wide range of applications, this innovative technology ensures smooth communication and efficient operation. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations and provide unmatched value. Elevate your projects with the SNJ54LVTH574W and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and protection, making it suitable for rugged environments.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with common power sources and systems.

No. of Bits: 8

Having 8 bits allows for a wider range of data processing and communication capabilities.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for high flexibility and control over the output signals.

Maximum Frequency At Nominal Supply: 150000000 Hz

With a high maximum frequency, this bus driver/transceiver can handle fast data transmission and processing.

Technical Specifications

Bus Driver & Transceivers SNJ54LVTH574W attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 374

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

Length:

13.09 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

5.9 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.92 mm

Trade Compliance

SNJ54LVTH574W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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