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SNJ54LS243J

Texas Instruments

SNJ54LS243J by Texas Instruments

SNJ54LS243J by Texas Instruments is a 4-bit bus driver with 18ns propagation delay, operating at 5V. It features MIL-PRF-38535 screening and 3-STATE output characteristics. Ideal for bidirectional control applications in military-grade environments.

Median Price

$13.760

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Rochester

USA . 33 parts In-Stock

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$13.760

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$13.480

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$13.210

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Freelance Electronics

USA . 1,098 parts In-Stock

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$6.187

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$6.496

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$6.125

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Vyrian

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Digiode

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Electronic Expediters

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Mil-Aero Solutions, Inc.

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Resion

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Legend Electronics Inc.

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Bristol Electronics

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Atlantic Semiconductor

USA . 16 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 11 parts In-Stock

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NAC Semi

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North Shore Components

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Sogenti Electronics

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Eagle Technology Solutions

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Distributors (Availability)

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Andel Nordic

Denmark . 2,030 parts In-Stock

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$5.273

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$5.062

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$5.062

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$5.273

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$5.062

AZTECH Wire

Italy . 271 parts In-Stock

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$9.264

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Parana Technologies

USA . 1,218 parts In-Stock

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$11.121

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$11.574

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DigiPath Technology Company

USA . 2,179 parts In-Stock

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$12.246

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$11.266

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IDEA Electronic Components Group

UK . 1,793 parts In-Stock

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$12.496

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$11.871

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$11.246

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ChromeModa Solutions

Germany . 989 parts In-Stock

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$10.247

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One Stop Electronics

USA . 941 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,815 parts In-Stock

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Microchip USA

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Corphita

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ChipstoGo Electronic ltd

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Overview

Unlock the power of seamless data transmission with the Texas Instruments SNJ54LS243J Bus Driver & Transceivers. Crafted with precision using top-quality materials, this product guarantees reliable performance and durability. Ideal for a wide range of applications, this versatile device offers unparalleled value to customers seeking efficiency and speed in their electronic systems. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection for the internal components of the bus driver and transceiver, ensuring reliable performance in various conditions.

Propagation Delay At Nominal Supply: 18 ns

The low propagation delay at nominal supply allows for fast data transmission and response times, making this product suitable for high-speed communication applications.

No. of Functions: 4

Having 4 functions in one component simplifies circuit design and reduces the number of components needed, saving space and potentially lowering overall costs.

Screening Level: MIL-PRF-38535

Compliance with MIL-PRF-38535 screening level indicates high reliability and quality standards, making this product suitable for military and other mission-critical applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit board layouts and provides a compact form factor for space-constrained applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a common standard in many electronic systems, ensuring compatibility and ease of integration with existing designs.

Load Capacitance (CL): 45 pF

The specified load capacitance helps optimize signal integrity and performance in driving external loads, ensuring reliable operation in various operating conditions.

Power Supplies (V): 5

Operating at a power supply voltage of 5V simplifies power management and compatibility with other components in the system, making installation and operation straightforward.

Terminal Position: DUAL

The dual terminal position provides flexibility in mounting and connections, allowing for versatile installation options and ease of integration into different system layouts.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with other components in the system, reducing the risk of errors and ensuring reliable performance.

Technical Specifications

Bus Driver & Transceivers SNJ54LS243J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LS

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.62 mm

Trade Compliance

SNJ54LS243J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-111-4919, 5962011114919, 5962-01-433-5094, 5962014335094

NIIN

011114919, 014335094

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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