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SNJ54HC368J

Texas Instruments

SNJ54HC368J by Texas Instruments

SNJ54HC368J by Texas Instruments is a CMOS bus driver with 2 functions, 4 bits, and 3-STATE output. It has a propagation delay of 29 ns at 5V supply voltage, suitable for military applications with MIL-PRF-38535 screening level. The package is ceramic/glass-sealed, rectangular in shape, with through-hole terminals and operates b/w -55 to 125 °C temperature range.

Median Price

$15.176

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Chip1Stop

Japan . 80 parts In-Stock

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$12.066

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$12.066

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Rochester

USA . 69 parts In-Stock

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$13.490

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$12.070

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$11.360

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$11.360

DigiKey

USA . 69 parts In-Stock

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$17.750

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$17.750

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Verical

USA . 69 parts In-Stock

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$16.863

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$15.088

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$14.200

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Distributors (In-Stock)

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Freelance Electronics

USA . 10 parts In-Stock

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$5.679

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$5.963

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$5.622

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$5.679

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Digiode

USA . 4,041 parts In-Stock

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$12.378

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Vyrian

USA . 7,376 parts In-Stock

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ComSIT Distribution GmbH

Germany . 121 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 82 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 8 parts In-Stock

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Component Sense

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Sinequanon

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Manoshevitz Elec. Sales

Israel . 2 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 5,449 parts In-Stock

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$10.392

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$9.976

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$9.976

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$10.392

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$9.976

$9.976

Corphita

USA . 3,339 parts In-Stock

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$11.727

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$11.727

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Parana Technologies

USA . 1,516 parts In-Stock

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$23.502

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$24.133

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DigiPath Technology Company

USA . 1,437 parts In-Stock

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$25.879

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$23.809

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$26.040

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$25.780

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$24.738

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$26.040

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ChromeModa Solutions

Germany . 6,707 parts In-Stock

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$26.407

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$21.654

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$26.407

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IDEA Electronic Components Group

UK . 571 parts In-Stock

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$26.407

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$25.087

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$23.766

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Microchip USA

USA . 1,991 parts In-Stock

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$33.800

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$33.310

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$33.070

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$32.830

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$32.830

Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 82 parts In-Stock

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Glotronic Ltd.

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Assy Fe

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Overview

Get ready to experience top-notch performance with the SNJ54HC368J by Texas Instruments, a leading manufacturer in the industry. This bus driver and transceiver offers reliability and precision in a variety of applications. With its advanced technology and military-grade screening level, this product ensures optimal functionality and durability. Trust Texas Instruments to deliver quality products that exceed expectations. Elevate your projects with the SNJ54HC368J and enjoy seamless operation like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package body material provides durability and protection for the internal components, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 29 ns

Low propagation delay ensures fast signal transmission, making this product suitable for applications requiring quick response times.

No. of Functions: 2

Having multiple functions in one component saves space and simplifies circuit design.

Screening Level: MIL-PRF-38535

Military screening level ensures high-quality and reliable performance in critical applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into existing systems and provides efficient use of space.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage is commonly used in electronic systems, making integration easy.

Load Capacitance (CL): 150 pF

Suitable load capacitance for efficient signal transmission and minimal interference.

Power Supplies (V): 2/6

Compatible with 2V and 6V power supplies, providing flexibility in different operating environments.

No. of Terminals: 16

Sufficient number of terminals for connectivity options and versatile circuit configurations.

Output Characteristics: 3-STATE

3-state output allows for multiple logic levels, increasing functionality and versatility.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in harsh environmental conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SNJ54HC368J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ONE FUNCTION WITH TWO BITS

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

29 ns

Propagation Delay (tpd):

180 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNJ54HC368J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-245-1730, 5962012451730, 5962-01-266-1431, 5962012661431, 5962-01-391-7123, 5962013917123

NIIN

012451730, 012661431, 013917123

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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