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SNJ54HC245FK

Texas Instruments

SNJ54HC245FK by Texas Instruments

SNJ54HC245FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 22ns, operating at a supply voltage range of 2-6V. It features CMOS technology, 3-STATE output characteristics, and is suitable for bidirectional control applications in military-grade environments.

Median Price

$34.990

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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NAC Semi

USA . 9 parts In-Stock

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Vyrian

USA . 8,317 parts In-Stock

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Digiode

USA . 4,218 parts In-Stock

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Dan-Mar Components

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Bristol Electronics

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ECAB

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Electronic Expediters

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Resion

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Andel Nordic

Denmark . 3,300 parts In-Stock

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$2.124

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$2.039

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$2.039

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One Stop Electronics

USA . 1,001 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 505 parts In-Stock

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Parana Technologies

USA . 467 parts In-Stock

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DigiPath Technology Company

USA . 2,003 parts In-Stock

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ChromeModa Solutions

Germany . 6,537 parts In-Stock

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IDEA Electronic Components Group

UK . 1,184 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Corphita

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Microchip USA

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Assy Fe

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A-Plus Industry Inc.

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Overview

Enhance your electronic designs with the SNJ54HC245FK by Texas Instruments, a high-quality bus driver & transceiver offering reliable performance and versatility. With a military-grade screening level and a wide temperature range, this chip carrier package provides 8 bits of true output polarity control in a compact design. Ideal for applications requiring bidirectional communication, this IC ensures fast propagation delays and low power consumption. Trust Texas Instruments for innovative solutions that deliver exceptional value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for rugged environments.

Nominal Supply Voltage / Vsup (V): 6

Stable supply voltage ensures consistent performance and reliability.

Load Capacitance (CL): 150 pF

Optimum load capacitance for efficient and reliable signal transmission.

Maximum Operating Temperature: 125 °C

Can operate effectively in high-temperature environments without performance degradation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient.

Technical Specifications

Bus Driver & Transceivers SNJ54HC245FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

6

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Translation:

N/A

Width:

8.89 mm

Trade Compliance

SNJ54HC245FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-287-8533, 5962012878533

NIIN

012878533

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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