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SNJ54BCT620AFK

Texas Instruments

SNJ54BCT620AFK by Texas Instruments

SNJ54BCT620AFK by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.9 ns at 5V, suitable for military-grade applications. It features a max operating temperature of 125°C, output polarity inverted, and independent control for bidirectional communication in a chip carrier package.

Median Price

$48.128

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,266 parts In-Stock

1+ parts

$48.128

100+ parts

$42.780

1k+ parts

$31.456

10k+ parts

-

1,266

$48.128

$42.780

$31.456

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,097 parts In-Stock

1+ parts

$45.722

100+ parts

-

1k+ parts

-

10k+ parts

-

2,097

$45.722

-

-

-

Vyrian

USA . 6,272 parts In-Stock

1+ parts

-

100+ parts

-

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6,272

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,603 parts In-Stock

1+ parts

$6.931

100+ parts

-

1k+ parts

$6.654

10k+ parts

$6.654

3,603

$6.931

-

$6.654

$6.654

Parana Technologies

USA . 428 parts In-Stock

1+ parts

$12.860

100+ parts

-

1k+ parts

$13.341

10k+ parts

-

428

$12.860

-

$13.341

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ChromeModa Solutions

Germany . 2,111 parts In-Stock

1+ parts

$14.450

100+ parts

$11.849

1k+ parts

-

10k+ parts

-

2,111

$14.450

$11.849

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-

IDEA Electronic Components Group

UK . 521 parts In-Stock

1+ parts

$14.450

100+ parts

$13.728

1k+ parts

$13.005

10k+ parts

-

521

$14.450

$13.728

$13.005

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AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$14.450

100+ parts

-

1k+ parts

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520

$14.450

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Corphita

USA . 210 parts In-Stock

1+ parts

$43.315

100+ parts

-

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210

$43.315

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-

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Component Stockers USA

USA . 397 parts In-Stock

1+ parts

$99.990

100+ parts

-

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397

$99.990

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Microchip USA

USA . 2,601 parts In-Stock

1+ parts

-

100+ parts

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2,601

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DigiPath Technology Company

USA . 754 parts In-Stock

1+ parts

-

100+ parts

$13.028

1k+ parts

-

10k+ parts

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754

-

$13.028

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Overview

Unlock unparalleled performance and reliability with the SNJ54BCT620AFK by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality bus drivers and transceivers that are perfect for a wide range of applications. With a MIL-PRF-38535 screening level and advanced technology, this product ensures seamless data transmission and exceptional signal integrity. Experience the benefits of fast propagation delay, low power consumption, and 3-state output characteristics. Trust Texas Instruments to provide you with innovative solutions that exceed your expectations. Elevate your projects with the SNJ54BCT620AFK today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh environments.

Propagation Delay At Nominal Supply: 6.9 ns

The low propagation delay allows for fast signal transmission, improving the overall performance of the bus driver.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB.

Screening Level: MIL-PRF-38535

This screening level ensures high quality and reliability, meeting military standards for critical applications.

No. of Bits: 8

Having 8 bits allows for a wider range of data transmission, making the product suitable for diverse applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with most systems and ensures stable performance.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures proper signal transmission without distortion or loss.

Power Supplies (V): 5

Having a consistent power supply voltage ensures reliable operation and prevents damage to the product.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting to other components and enables versatile circuit design.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compact size and efficient heat dissipation, optimizing board space and thermal management.

Technical Specifications

Bus Driver & Transceivers SNJ54BCT620AFK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

IOL = 20MA @ VOL = 0.5V & IOH = 3MA @ VOH = 2.4V FOR PORT A

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

84 mA

Propagation Delay At Nominal Supply:

6.9 ns

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

8.89 mm

Trade Compliance

SNJ54BCT620AFK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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